The MEMS Handbook (1st Ed) - M Gad el Hak Part 3 pptx

... super-Burnett equations), or moment methods based on taking the moments of the Boltzmann equation with flow variables (leading to Grad’s 1 3- moment equations or Levermore’ moment equations, for example). ... sensing, computation, actuation, control, communication and power generation within the same microchip. The small size, light weight and high-durability of MEMS, combined with t...

Ngày tải lên: 10/08/2014, 02:21

... Mohamed Gad- el- Hak Introduction • Flow Physics • Fluid Modeling • Continuum Model • Compressibility • Boundary Conditions • Molecular-Based Models • Liquid Flows • Surface Phenomena • Parting ... Parting Remarks 5 Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains Robert M. Kirby, George Em Karniadakis, Oleg Mikulchenko, Kartikeya Mayaram...

Ngày tải lên: 10/08/2014, 02:21

... discusses molecular-based models and their relation to the continuum models previously considered. The most fundamental of the molecular models is a deterministic one. The motion of the molecules is ... containing 34 20 0- µ m- wide × 10 0- µ m- deep channels machined into the 20 0- µ m- thick stainless steel foils by the process of direct, high-precision...

Ngày tải lên: 10/08/2014, 02:21

... cells are also active areas of research. Before multiphase flow in microchannels becomes a reality, however, several fundamental problems that arise from the small dimension of the channels must ... Most of these problems originate from the large curvature of the interface between two phases in these small channels. As a result, capillary effects and other related phenomena dominate in...

Ngày tải lên: 10/08/2014, 02:21

... only 0.9 m for an etch depth of 36 0 m. For a 1-mm-long V-groove and a 1° misalign- ment angle, a total underetching of 18 m is theoretically expected, with 95% due to misalignment and only ... R 111 the etch rate in nm/min and R v the groove widening, also in nm/min. The V-groove widening experiment then results in a R 111 of 2.55 ± 0.15 nm/min. In practice, this etch rate im...

Ngày tải lên: 10/08/2014, 02:21

... A, 25, 559–5 63, 1991. Bustgens, B., W. Bacher, W. Menz, and W. K. Schomburg, “Micropump Manufactured by Thermoplastic Molding,” Proceedings. IEEE Micro Electro Mechanical Systems (MEMS ’94), Oiso, ... A, 25, 559–5 63, 1991. Bustgens, B., W. Bacher, W. Menz, and W. K. Schomburg, “Micropump Manufactured by Thermoplastic Molding,” Proceedings. IEEE Micro Electro Mechanical Systems (MEMS ’94),...

Ngày tải lên: 10/08/2014, 02:21

... Harsh-Environment MEMS Substrates • Metallization/Electrical Interconnection System • Die-Attach • Hermetic Sealing 23. 3 High-Temperature Electrical Interconnection System Thick-Film Metallization ... Thick-Film-Based Wirebond • Conductive Die-Attach 23. 4 Thermomechanical Properties of Die-Attach Governing Equations and Material Properties • Thermomechanical Simulation of...

Ngày tải lên: 10/08/2014, 02:21