The MEMS Handbook (1st Ed) - M Gad el Hak Part 1 ppsx

... Man-Made Devices 10 20 10 18 10 16 10 14 10 12 10 10 10 8 10 6 10 4 10 2 10 2 10 0 10 -2 10 -4 10 -6 10 -8 10 -1 0 10 -1 2 10 -1 4 10 -1 6 Diameter of Proton © 2002 by CRC Press LLC ... in meters. Lower scale continues in the upper bar from left to right. One meter is 10 6 µ m, 10 9 nm or 10 10 Å. Typical Ma...

Ngày tải lên: 10/08/2014, 02:21

... discusses molecular-based models and their relation to the continuum models previously considered. The most fundamental of the molecular models is a deterministic one. The motion of the molecules is ... containing 34 20 0- µ m- wide × 10 0- µ m- deep channels machined into the 20 0- µ m- thick stainless steel foils by the process of direct, high-precision...

Ngày tải lên: 10/08/2014, 02:21

... communication and power generation within the same microchip. The small size, light weight and high-durability of MEMS, combined with the mass-fabrication ability, result in low-cost systems ... Walls,” Chem. Eng. Commun. 38, pp. 93 10 6. Arkilic, E.B., Schmidt, M. A., and Breuer, K.S. (19 97) “Gaseous Slip Flow in Long Microchannels,” J. MEMS 6, pp. 16 7 17 8. Baker, D.R. (19 95)...

Ngày tải lên: 10/08/2014, 02:21

... LLC 11 Bubble/Drop Transport in Microchannels 11 .1 Introduction 11 .2 Fundamentals 11 .3 The Bretherton Problem for Pressure-Driven Bubble/Drop Transport Corrections to the Bretherton ... Pressure-Driven Flow 11 .4 Bubble Transport by Electrokinetic Flow 11 .5 Future Directions Acknowledgments 11 .1 Introduction Many microdevices involve fluid flows. Microducts, micr...

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... principle stems from mask misalignment and/or from a finite etching of the {11 1} planes. Peeters measured the widening of {11 1}-walled V-grooves in a (10 0) Si wafer after etching in 7 M KOH at 80 ± 1 over 24 ... The sidewall slopes of the V-groove are a well-defined 54.74°, and the actual etch rate R 11 1 is related to the rate of V-groove widening R v through: (16 . 41)...

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... Tool 19 .9 Materials for EFAB 19 .10 EFAB Performance Accuracy • Materials Properties 19 .11 EFAB Compared with Other SFF Processes 19 .12 EFAB Compared with Other Microfabrication Processes 19 .13 ... 25, 559–563, 19 91. Bustgens, B., W. Bacher, W. Menz, and W. K. Schomburg, “Micropump Manufactured by Thermoplastic Molding,” Proceedings. IEEE Micro Electro Mechanical Systems (MEMS...

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... Harsh-Environment MEMS Substrates • Metallization/Electrical Interconnection System • Die-Attach • Hermetic Sealing 23.3 High-Temperature Electrical Interconnection System Thick-Film Metallization ... mechanical devices. Via microlevel mechanical operation, MEMS devices, as sensors, transform mechanical, chem- ical, optical, magnetic and other nonelectrical parameters to electrica...

Ngày tải lên: 10/08/2014, 02:21