An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 9 pps

... Heads 11 6 Micromachined Valves 11 9 Micropumps 12 6 Summary 12 8 References 12 9 Selected Bibliography 13 1 CHAPTER 5 MEM Structures and Systems in Photonic Applications 13 3 Imaging and Displays 13 3 Infrared ... Capacitors and Inductors 19 0 Quality Factor and Parasitics in Passive Components 19 0 Surface-Micromachined Variable Capacitors 19 2 Bulk-Micromachined Variable...

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... 1 .2 Analysis and Forecast of Worldwide MEMS Markets (in Millions of U.S. Dollars) 20 02 2007 ($ 000,000) ($ 000,000) Microfluidics 1,404 2, 241 Optical MEMS 7 02 1, 826 RF MEMS 39 24 9 Other actuators ... Market Study,” January 1999, 1 429 North Quincy Street, Arlington, VA 22 207. [3] Frost and Sullivan, “World Sensors Market: Strategic Analysis,” Report 550 9-3 2, Febr...

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... 15 Polyvinylidene-fluoride (PVDF) d 31 = 23 d 33 = 33 12 1.78 3 2.7 LiNbO 3 d 31 =−4, d 33 = 23 28 4.6 245 34 BaTiO3 d 31 = 78, d 33 = 190 1,700 5.7 30 PZT d 31 =−171 d 33 = 37 0 1,700 7.7 53 30 zinc oxide (ZnO) d 31 = 5.2, d 33 = ... abformung, meaning lithography, elec - troplating, and molding. both PSG and BPSG soften and flow to conform with...

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... Wet etchants in aqueous solution offer the advantage of low-cost batch fabrication—25 to 50 100-mm-diameter wafers can be etched simultaneously and can be either of the isotropic or anisotropic ... uniform and controlled etch depths. Some applications, such as bulk-micromachined pressure sensors, demand a thin ( 5- to 2 0- m) silicon mem - brane with dimensional thickness cont...

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... Benecke, and P. Lange, “TMAHW Etchants for Silicon Micromachining,” Proc. 1991 Int. Conf. on Solid-State Sensors and Actuators, San Fran- cisco, CA, June 24–27, 1991, pp. 8 15 818. [9] Ammar, E. S., and ... Bonding and Deep Reactive Ion Etching; A New Technology for Microstructures,” Proc. 8th Int. Conf. on Solid-State Sensors and Actua - tors, Stockholm, Sweden, June 25 29, 19...

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... orientation-dependent etching of grooves, wafer bonding, and dicing [8], and (b) nozzle formed by DRIE and wafer bonding. (After: [9].) Mandrel Photoresist 1. Make mandrel, pattern photoresist Metal 2. ... 9.81 m/s 2 ), sensitivity (V/G), reso - lution (G), bandwidth (Hz), cross-axis sensitivity, and immunity to shock. The range and bandwidth required vary significantly depend...

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... )]°⋅sHz ; bandwidth (Hz); resolution (º/s); and dynamic range (dB), the lat- ter two being functions of noise and bandwidth. Short- and long-term drift of the output, known as bias drift, is another ... dioxide insulator TaAl resistor Al conductor 1. Grow oxide for insulator, sputter TaAl and Al, pattern Al and TaAl, pattern Al again to form resistor and conductive trace. 2. PEC...

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... Improvements and Methods,” Tech. Digest Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, June 8 11, 19 98, pp. 7–10. [43] U.S. Patent 6,533,366, March 18, 2003. [44] U.S. Patents 4 ,82 4,073, ... Int. Conf. on Solid-State Sensors and Actuators, Chicago, IL, June 16–19, 1997, Vol. 2, pp. 84 7 85 0. 130 MEM Structures and Systems in Industrial and Automotive Applica...

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... unloaded actuator on the right-hand side is equal to the mass of the loaded actuator (left-hand side) and the mirror. Externally applied in-plane accelerations cause equal but opposite torques on ... (known as the L-Band). The International Telecommunication Union (ITU) of Geneva, Switzerland, has specified the use to be on a grid of discrete channels throughout the C- and L-Bands at...

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... 1991, pp. 310 317. [10] Jerman, H., and J. D. Grade, “A Mechanically-Balanced, DRIE Rotary Actuator for a High-Power Tunable Laser,” Tech. Digest Solid-State Sensor and Actuator Workshop, Hil - ton ... it remains an enabling technology and a means to an end. It is impera - tive to understand the final application in order to assess the importance and applicability o...

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... discrete inductors (in addition to even more capacitors and resistors) along with only 15 integrated circuits [12]. To alleviate the self-resonance shortcoming and to reduce the part count and space ... of expansion mismatch factor into substrate selection. Passive Electrical Components: Capacitors and Inductors Quality Factor and Parasitics in Passive Components All capacit...

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... requirements, standards for MEMS packaging lack, and designs often remain proprietary to com - panies. Invariably, the difficulty and failure in adopting standards implies that pack - aging will remain engineering- resource ... al., “A Low-Noise RF Voltage-Controlled Oscillator Using On-Chip High-Q Three-Dimensional Inductor and Micromachined Variable Capacitor,” Technical...

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... available in TO- type hermetic metal packages. How - ever, pressure to reduce manufacturing costs has led the company to adopt a stan - dard plastic dual-in-line (DIP) solution and establish first-level ... and electricity—voltage, current, and electrical resistance are dual to temperature, heat flux, and thermal resistance, respectively. A network of resistors is an...

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... for optoelectronic and passive fiber-optical components (see Table 8.8) explicitly reference the MIL-STD-202 and 883 standards. Procedures and methods also accompany the MIL standards to guide ... rates and mean time to failures) of electronic equipment [26]. An industry of professional consultants and advisors specializing in quality and reliability standards has come to...

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... 9000/QS 9000, 244 standards, 244–46 statistical methods in, 246–48 tests, 246 See also Failure(s); Quality control Resonators, 200–211 beam, 203–6 comb-drive, 201–3 coupled-resonator bandpass filter, ... schematic, 164 defined, 161 diffraction operation, 163 fabrication, 165 key characteristics, 161 principle of operation, 162 Voltage-controlled oscillators (VCOs), 192 Volume manu...

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