Engineering Materials and Processes phần 1 doc
Engineering Materials and Processes phần 1 doc
... Engineering Materials and Processes Dedicated to our ever patient, supportive and loving wives, Madeline, Katherine and Betty 1 Introduction 1. 1 Silver Metallization ... ………………………….…………… … 10 4 6.3.3 Results and Discussions ……………………………………… 10 5 6.3.4 Conclusions ………………………………………………….… 10 9 6.4 References …………………………………………………………… 11 0 7 Su...
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Engineering Materials and Processes phần 3 docx
... down to about 1x10 10 Torr. During annealing the vacuum in the furnace was about 1 x10 –8 Torr. Sheet resistances of the TaN/Si and Ag/TaN/Si structures were measured, both before and after ... lowest resistance (R cond ) and it is also the thickest layer. Therefore, 1/ R cond » 1/ R passivation (R passivation , resistance of encapsulation) and 1/ R total ~1/ R cond o...
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Engineering Materials and Processes phần 6 doc
... [16 ] 25 20 15 10 5 0 0.0 5.0x10 3 1. 0x10 4 1. 5x10 4 2.0x10 4 Si Ag Al O P - P Height Sputter Time (min) P-P Hei g ht ( Arb. Units ) 30 25 20 15 10 5 0 0.0 5.0x10 3 1. 0x10 4 1. 5x10 4 2.0x10 4 Si Ag Al O O P ... Moghadam, and T. L. Alford, Thin Solid Films 262, 15 4 (19 95). [10 ] 19 98 Annual Book of ASTM Standards, edited by R. A. Storer (ASTM, Philadelphia), Vol. 6. 0...
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environmental engineering dictionary and directory phần 1 docx
... the continued patience and support of my wife, Julie, and our children, Chad, Sarah, Mike, and Katie. This book is dedicated to my wife, Julie Lynn Pankratz, and our grandson, Gabriel R. Suarez, ... different kinds of grazing animals which consume similar kinds of forage, where 1AU is equivalent to the weight of 1 cow and 1 calf set at 454 kg. anion A negatively charged ion that...
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Engineering Materials and Processes phần 2 pptx
... Electrochem. Soc. 13 3 12 43 (19 86). [8] T. E. Graedel, J. Electrochem. Soc. 13 9(7), 19 63 (19 92). [9] B. Chalmers, R. King, R. Shuttleworth, Proc. R. Soc. A 19 3, 465 (19 48). [10 ] A. E. B. Presland, G. L. ... of the projectile energies for M 1 < M 2 is given by: 2 1 222 2 12 1 1 o 21 E(MMsin)Mcos K EMM ⎡⎤ −ϑ+ϑ ⎢⎥ == ⎢⎥ + ⎢⎥ ⎣⎦ (2 .1) The energy ratio K = E 1...
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Engineering Materials and Processes phần 4 pptx
... Standard (JCPDS ICDD cards #: 25 -12 80, 26-0985, 32 -12 82, 25 -12 78, 14 -04 71, 31- 1370, & 32 -12 83), PDF Database, 19 94. [18 ] G. S. Chen, and T. S. Chen, J. Appl. Phys. 87, 8473(2000). [19 ] ... spectra show prominent Ag {11 1} and the TaN peaks identified in Figure 3 .10 . The intensity of the Ag {11 1} peak increases for the 600°C anneal. This implies that < ;11...
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Engineering Materials and Processes phần 5 pptx
... X-ray diffraction pattern of Ag on Pa-n. Ag film shows prominent (11 1) peak. The intensity of (11 1) peak increases up to 300°C and then suddenly decreases for 350°C. X-ray diffraction does not ... Pa-n completely. Formation of single and double bonds between carbon and oxygen [11 ] during plasma treatment may have helped increase adhesion between Ag and Pa-n. 4.3.5 Conclusions...
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Engineering Materials and Processes phần 7 ppsx
... A′ 11 .0 11 13 voids B′ 7.0 4–5 voids C′ 9.0 8–9 voids D′ 10 .0 8–9 voids 6 Integration Issues 6 .1 Factors Influencing the Kinetics in Silver- luminum Bilayer Systems 6 .1. 1 Introduction ... on SiO 2 before and after annealing at 600°C in an NH 3 ambient for 12 0 minutes. Only the surface peaks and positions are shown [8]. 30 40 50 60 70 80 90 0 2 4 6 8 10 12...
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Engineering Materials and Processes phần 8 pdf
... bilayer and E a = 0.34±0.05 eV for the Ag (200 nm)/Al(30 nm) bilayers and represents the energy barrier of the limiting step in the surface oxide formation process. 1. 1 1. 2 1. 3 1. 4 1. 5 0 1 2 3 4 5 6 7 8 ... Integration Issues 89 30 40 50 60 70 80 90 6 7 8 9 10 11 12 13 14 Ag(200nm)/Al(30nm) on SiO 2 400 o C 500 o C 600 o C Thickness (nm) time 1/ 2 (s 1/ 2 )...
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Engineering Materials and Processes phần 9 ppsx
... Integration Issues 11 1 [18 ] Y. Zeng, Y. L. Zou, T. L. Alford, S. S. Lau, F. Deng, T. Laursen and B. M. Ullrich, J. Appl. Phys. 81, 7773 (19 97). [19 ] B. A. Julies, D. Knoesen, R. ... Press, Cambridge, UK, 19 87). [15 ] K. Sieradzki, K. Baily, and T. L. Alford, Appl. Phys. Lett. 79, 34 01 (20 01) . [16 ] M. M. Mitan, T. L. Alford, Thin Solid Films 434, 258 (2003). [17 ] T...
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