Solid State Circuits Technologies Part 1 pot

Solid State Circuits Technologies Part 1 pot

Solid State Circuits Technologies Part 1 pot

... I REF (=I 1 +I 2 ) is given by 10 12 1 2 01 02 (1 ) == = (1 ) (1 ) BE BE BE REF VV BT V AT III RRR TR T αα Δ− ++ + ++ 01 01 02 1 = ( ) (1 ) (1 ) (1 ) BE V BT T AT T RR α α −+ − − 01 01 02 1 () ... can be expressed as Solid State Circuits Technologies 10 M 3 V REF M 2 M 1 M 5 M 6 M 7 M 8 M 9 M 10 M 11 M 4 I 1 I 1 I 1 I 2 R 1 R 2 R 3...
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Solid State Circuits Technologies Part 9 potx

Solid State Circuits Technologies Part 9 potx

... (Pozar, 19 98) as follows: 11 22 12 21 11 11 22 12 21 1 (1 ) (1 ) (1 ) (1 ) o SSSS Y ZSSSS −++ =× ++− (22) 12 12 11 22 12 21 12 (1 ) (1 ) o S Y ZSSSS − =× ++− (23) 21 21 11 22 12 21 12 (1 ) (1 ... 22 12 21 1 2 1( 1 ) (1 ) ( 2) (1 ) (1 ) 2 o SSSS YYY Y ZSSSS YY −++ + ×=+ ++− (26) 12 12 11 22 12 21 2 11 12 1 21 (1 ) (1 ) o S YY ZSSSS...
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Solid State Circuits Technologies Part 15 potx

Solid State Circuits Technologies Part 15 potx

... cause Solid State Circuits Technologies 426 R 1 , R 2 and C 1 , and the other LPF is provided by R 3 , R 4 , R DS and C 2 . The pass band edge f P is set by (2.9): 43 2 1 21 11 2( || ... specifications in Table 2. Fig. 11 . Time response of reproducibility Solid State Circuits Technologies 432 Fig. 12 . ISFET drift characteristics at pH=7,...
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Solid State Circuits Technologies Part 2 ppt

Solid State Circuits Technologies Part 2 ppt

... 90 μ A 10 0 μ A 11 0 μ A 12 0 μ A 13 0 μ A -0.5V 0 0.5V ΔV=0.35V Output current ( μ A) Δ I 2 =11 .4 μ A Δ I 1 =10 .5 μ A 13 1 μ A 12 5 μ A 11 9.6 μ A 11 4.5 μ A ERROR 2 = 0.9 μ A ERROR 1 = 11 9.6 μ A -11 4.5 μ A =5 .1 μ A ... bus are 10 000 010 1 2 ” representing the global winner is vector #5 (0 010 1 2 ) of core #0 (00 2 ) in chip #2 (10 2 ) and 10 1 010 111 2 ” repres...
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Solid State Circuits Technologies Part 3 doc

Solid State Circuits Technologies Part 3 doc

... transistor. Solid State Circuits Technologies 62 By inspection of equations (10 ) and (11 ), a loop-hole can be found in Lundstrom’s 19 97 theory. If equations (10 ) and (11 ) are correct, ... C.T. (19 91) . Fundamentals of Solid- State Electronics, 1 st ed., World Scientific, ISBN: 9 810 206372, Singapore, p.245. (b) Sah, C.T. (19 91) . Fundamentals of Solid- State...
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Solid State Circuits Technologies Part 11 pdf

Solid State Circuits Technologies Part 11 pdf

... 18 0ps 10 -12 10 -14 10 -8 10 -10 10 -4 10 -6 10 0 10 -2 Timing in Uplink, T U (36ps/step) Bit Error Rate Timing in Uplink, T U Timing in Downlink, T D 16 ch. Test Test Pattern : PRBS 2 31 -1 After ... Adjustment 18 0ps 36ps/step Optim. Timing 18 0ps 10 -12 10 -14 10 -8 10 -10 10 -4 10 -6 10 0 10 -2 Timing in Uplink, T U (36ps/step) Bit Error Rate...
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Solid State Circuits Technologies Part 13 docx

Solid State Circuits Technologies Part 13 docx

... 14 0 16 0 0.0 0.4 0.8 1. 2 1. 6 80 10 0 12 0 14 0 16 0 × × × 0 0.4 1. 2 1. 6 Damping ratio ζ Radius of acoustic hole r [μm] 40 50 60 70 80 0.707 n = 37 n = 16 1 n =12 1 δ =18 0 n = 21 δ =18 0 δ =18 0 ... μ m 3 0 45° 60° 12 0° 13 5° 0 ° 90 o 60 o 60 o 90 o 30 o 0 o 30 o 3 0 45° 60° 12 0° 13 5° 0 ° 0+4 -4 [dB] ( d ) R = 500 μ m 90 o 60 o 60 o 90 o 30 o 0 o 30...
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Solid State Circuits Technologies Part 16 pptx

Solid State Circuits Technologies Part 16 pptx

... Polymer Journal, Vol. 38, No. 9, (September 2002) pp .19 15 -19 19, ISSN 0 014 -3057 Solid State Circuits Technologies 444 Wong, H. & White, H. (19 89) A CMOS -integrated ISFET operational amplifier, ... prototype Solid State Circuits Technologies 454 blood cells (Fig. 11 (b)), even after ultrasonic cleaning in surfactant induced water (Fig. 11 (c)) (Shinoh...
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Advances in Solid State Circuits Technologies pot

Advances in Solid State Circuits Technologies pot

... represented as: t 1 : ),( 21 1 1 inint VVCOMP , ),( 43 2 1 inint VVCOMP , …, ),( )( / inN Nin N t VVCOMP 1 2 1 − t 2 : ),( )/( 2 1 1 1 12 2 tt N t ZZCOMP + , ),( )/( 4 1 3 1 22 2 tt N t ZZCOMP + , ... transconductor is shown in Fig. 8. C V 2 M 8 M 12 M C V 1in V 1 M 2in V 3 M 4 M 7 M 5 M 9 M 6 M 10 M 11 M 2out I 1out I Bias V 13 M 14 M 15 M 16 M Fi...
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Solar Cells Silicon Wafer Based Technologies Part 1 pot

Solar Cells Silicon Wafer Based Technologies Part 1 pot

... composition of Germanium: E g (x)= (1. 155 – 0.43x + 0.0206x 2 )eV for 0 < x < 0.85 (17 ) and E g (x)= (2. 010 – 1. 27x)eV for 0.85 < x < 1 (18 ) The usage of SiGe alloy for solar ... Solar Cells – Silicon Wafer-Based Technologies 14 Fig. 11 . Typical of high efficient solar cell with dual cell tandem structure [12 ] . Fig. 12 . Lattice constants, band...
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