PUBLICLY AVAILABLE SPECIFICATION IEC PAS 61249 3 1 Pre Standard First edition 2007 05 Materials for printed boards and other interconnecting structures – Part 3 1 Copper clad laminates for flexible bo[.]
PUBLICLY AVAILABLE SPECIFICATION IEC PAS 61249-3-1 Pre-Standard First edition 2007-05 Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) Reference number IEC/PAS 61249-3-1:2007(E) LICENSED TO MECON Limited - RANCHI/BANGALORE FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU Materials for printed boards and other interconnecting structures – THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright © 2007 IEC, Geneva, Switzerland All rights reserved Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IEC's member National Committee in the country of the requester If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies About IEC publications The technical content of IEC publications is kept under constant review by the IEC Please make sure that you have the latest edition, a corrigenda or an amendment might have been published Catalogue of IEC publications: www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…) It also gives information on projects, withdrawn and replaced publications IEC Just Published: www.iec.ch/online_news/justpub Stay up to date on all new IEC publications Just Published details twice a month all new publications released Available on-line and also by email Customer Service Centre: www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service Centre FAQ or contact us: Email: csc@iec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 LICENSED TO MECON Limited - RANCHI/BANGALORE FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU IEC Central Office 3, rue de Varembé CH-1211 Geneva 20 Switzerland Email: inmail@iec.ch Web: www.iec.ch PUBLICLY AVAILABLE SPECIFICATION IEC PAS 61249-3-1 Pre-Standard First edition 2007-05 LICENSED TO MECON Limited - RANCHI/BANGALORE FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU Materials for printed boards and other interconnecting structures – Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) Commission Electrotechnique Internationale International Electrotechnical Com m ission Международная Электротехническая Комиссия PRICE CODE V For price, see current catalogue –2– PAS 61249-3-1 © IEC:2007(E) CONTENTS FOREWORD Scope Normative references Terms and definitions Designation of copper-clad laminates 4.1 Copper-clad laminate 4.2 Base materials 4.3 Thickness of the base material 4.4 Types of adhesives .8 4.5 Thickness of base materials and adhesives 4.6 Type of copper foil 4.7 Grade of copper foil 4.8 Copper-foil thickness 4.9 Types of profiles 10 4.10 Surface treatment to increase copper adhesivity and anti-rust 10 4.11 Symbol for flammability 10 Observation 10 5.1 Base film 10 5.2 Copper foil 11 5.3 CCL 11 Size 12 6.1 Base film 12 6.1.1 Thickness and its allowance 12 6.2 Copper foil 12 6.2.1 Thickness and its allowance 12 6.3 Adhesives 13 6.3.1 Adhesives 13 6.4 Copper-clad laminates 13 6.4.1 Thickness and its allowance 13 6.4.2 Sheet dimension and its allowance 13 6.4.3 Role dimension and its allowance 13 Properties 13 7.1 Base film 13 7.2 Copper foil 15 7.3 CCL 17 Package and labelling 25 Annex A (normative) Roughness test 26 Annex B (normative) Dimensional stability test 27 Appendix 30 Figure B.1 – Test pattern for the dimensional stability test 27 Table – Copper-clad laminates Table – Base materials Table – Thickness of base material Table – Adhesives LICENSED TO MECON Limited - RANCHI/BANGALORE FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU PAS 61249-3-1 © IEC:2007(E) –3– Table – Thickness of adhesives Table – Grade of copper foil Table – Thickness of copper foil (Types E and R) 10 Table – Types of profiles 10 Table – Appearance of CCL 11 Table 10 – Thickness and its allowance of base film 12 Table 11 – Thickness and its allowance of copper foil (Types E and R) 12 Table 12 – Thickness and its allowance of adhesives 13 Table 13 – Properties of polyimide film 14 Table 14 – Properties of copper foil (type E) 15 Table 15 – Properties of copper foil (type R) 16 Table 17 – Properties of CCL Non-adhesive type (two layers)/polyimide film base + copper foil (casting) 19 Table 18 – Properties of CCL Non-adhesive type (two layers)/polyimide film base + copper foil (sputter/plating) 21 Table 19 – Properties of CCL Non-adhesive type (two layers)/polyimide film base + copper foil (laminate) 23 LICENSED TO MECON Limited - RANCHI/BANGALORE FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU Table 16 – Properties of CCL Adhesive type (three layers)/polyimide film base 17 –4– PAS 61249-3-1 © IEC:2007(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES – Part 3-1: Copper-clad laminates for flexible boards (Adhesive and non-adhesive types) FOREWORD 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication 6) All users should ensure that they have the latest edition of this publication 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications 8) Attention is drawn to the Normative references cited in this publication Use of the referenced publications is indispensable for the correct application of this publication 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights IEC shall not be held responsible for identifying any or all such patent rights A PAS is a technical specification not fulfilling the requirements for a standard but made available to the public IEC-PAS 61249-3-1 was submitted by the JPCA (Japan Electronics Packaging and Circuits Association) and has been processed by IEC technical committee 91: Electronics assembly technology The text of this PAS is based on the following document: This PAS was approved for publication by the P-members of the committee concerned as indicated in the following document: Draft PAS Report on voting 91/616/NP 91/644/RVN Following publication of this PAS, which is a pre-standard publication, the technical committee or subcommittee concerned will transform it into an International Standard LICENSED TO MECON Limited - RANCHI/BANGALORE FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees) The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”) Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations PAS 61249-3-1 © IEC:2007(E) –5– This PAS shall remain valid for an initial maximum period of three years starting from 2007-05 The validity may be extended for a single three-year period, following which it shall be revised to become another type of normative document or shall be withdrawn LICENSED TO MECON Limited - RANCHI/BANGALORE FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU –6– PAS 61249-3-1 © IEC:2007(E) MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES – Part 3-1: Copper-clad laminates for flexible boards (Adhesive and non-adhesive types) Scope This PAS specifies the properties of copper-clad laminates used for flexible boards for both adhesive and non-adhesive types Normative references The following referenced documents are indispensable for the application of this document For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies JPCA-TD01, Terms and definition for printed circuits JIS C 5603, Terms and definition for printed circuits JIS C 6471, Test methods of copper-clad laminates for flexible printed wiring boards JIS C 6472, Copper-clad laminates for flexible printed wiring boards (Polymer film, Polyimide film) JIS C 6515, Copper foil for printed wiring boards IEC 60194, Printed board design, manufacture and assembly – Terms and definitions IPC-4204, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry ASTM D149, Standard Test Method for Dielectric Breakdown Voltage and Dielectric Strength of Solid Electrical Insulating Materials at Commercial Power Frequencies ASTM D150, Standard Test Methods for AC Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulation ASTM D882, Standard Test Method for Tensile Properties of Thin Plastic Sheeting Terms and definitions For the purposes of this document, the following terms and definitions, as well as those mentioned in IEC 60194, JIS C 5603 and JPCA-TD01, apply 3.1 machine direction (MD) longitudinal direction in production of film, copper foil, and copper-clad laminate 3.2 transverse direction (TD) transverse direction in production of film, copper foil, and copper-clad laminate Designation of copper-clad laminates The designation of types of laminates shall be made in the following way designations are connected by hyphens Constituent LICENSED TO MECON Limited - RANCHI/BANGALORE FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU PAS 61249-3-1 © IEC:2007(E) –7– Symbol for Symbol for Symbol for Symbol for Symbol for Symbol for identifying base material adhesive and type and grade profile and flammability copper-clad and its its thickness of copper-foil treatment laminate thickness (3.1) Example: ADF (3.2) (3.3) - (3.4) (3.5) E6 - TA (3.6) (3.7) (3.8) - E1/12/12 (3.9) (3.10) - V1 (3.11) - F Copper-clad laminate The symbol to show the types of flexible printed wiring boards (hereinafter called CCL) shall be as given in Table Table – Copper-clad laminates Symbol 4.2 Copper-clad laminate ADF Adhesive type (3-layer) CCL ALF Non-adhesive type (2-layer) CCL Base materials The symbol to designate the base material shall be as given in Table Table – Base materials Symbol E B A C D F G H J K L M X 4.3 Base material Polyimide Polyethylene telephthalate (PET) Polyvinyl fluoride (PVF ） Ethylene fluoride-propylene copolymer (FEP ） Polytetra fluoroethylene (PTFE ） Aramid Polyamide-imide Epoxy Polyether imide Polysulfone Polyethylene naphthalate (PEN ） Liquid crystal polymer (LCP) Others Thickness of the base material The symbol to designate the thickness of base material shall be as given in Table LICENSED TO MECON Limited - RANCHI/BANGALORE FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU 4.1 and thickness PAS 61249-3-1 © IEC:2007(E) –8– Table – Thickness of base material Symbol No base material 25 50 75 100 125 12,5 38 17,5 10 7,5 20 40 Other thickness NOTE A thickness of 15 μm is an example of another thickness 4.4 Types of adhesives The symbol to designate the adhesive shall be as given in Table Table – Adhesives 4.5 Symbol Adhesive L M N O P R S T U W Y X Epoxy resin Acrylate Polyester No adhesive Butyl phenol Ethylene fluoride–propylene copolymer (FEP) Nitrile phenol Polyimide Polyether Perfluoroalkoxy (PFA) Cyanate ester Other thickness Thickness of base materials and adhesives The symbol to designate the thickness of base material and adhesives shall be as given in Table LICENSED TO MECON Limited - RANCHI/BANGALORE FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU 10 11 12 X Thickness of base material μm PAS 61249-3-1 © IEC:2007(E) – 18 – Table 16 – Properties of CCL (continued) Item Unit － Flammability Specification Specimen shall satisfy the following specification Item (1) Flaming time According to 9.1 (flammability) Specification Within 10 s for each time, and total of less than 50 s for 10 trials Less than 30 s for the total of second trials There shall be no flaming or glowing There shall be no ignition NOTE Repeat the test when one specimen does not satisfy the test items (1) to (4), and the total flaming time of ten trials is between 51s and 55 s The specimens shall satisfy the specification in the repeated test Resistance to chemicals － There shall be no swell nor delamination Resistance to soldering － There shall be no considerable shrinkage, and no delamination of copper foil and base, nor swell Solderability － The area of copper foil with good solderability shall be over 95 % of the foil Chemicals for processing of copper foil － The chemical for copper-foil treatment shall not affect etching of CCL, soldering nor adhesiveness of electrolytic plating ％ ± 0,15 MD Dimensional stability (Thickness of polyimide film: 25 μm) After etching and drying TD According to 9.2 (resistance to chemicals) According to 9.3 (resistance to soldering heat) According to 9.4 (solderability) According to 9.5 (chemicals for processing of copper foil) According to 9.6 (dimensional stability) MD After etching and heating ± 0,20 TD MD After heating ±0,10 TD According to Method D in Annex B of this standard LICENSED TO MECON Limited - RANCHI/BANGALORE FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU (2) Flaming and glowing times (3) Flaming or glowing to the clamp, or marking line (4) Drop from specimen that ignite cotton Test method JIS C 6471