May 2010 Mai 2010 IEC 60191 6 18 (First edition – 2010) MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES – Part 6 18 General rules for the preparation of outline drawings of surface mounted semicon[.]
IEC 60191-6-18 CEI 60191-6-18 (First edition – 2010) (Première édition – 2010) MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES – NORMALISATION MÉCANIQUE DES DISPOSITIFS À SEMICONDUCTEURS – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA) Partie 6-18: Règles générales pour la préparation des dessins d’encombrement des dispositifs semiconducteurs pour montage en surface – Guide de conception pour les btiers matriciels billes (BGA) CORRIGENDUM 3.1 btier matriciel billes BGA Instead of: la place de: "a package that has " "un btier dont les billes métalliques " read: lire: "package that has " "btier dont les billes métalliques " 3.1 NOTE 3.1 NOTE Instead of: la place de: " (See Annex A)." " (Voir Annexe A)." read: lire: " (See Bibliography)." " (Voir Bibliographie)." 3.2 plastic ball grid array P-BGA 3.2 btier matriciel billes en plastique P-BGA Instead of: la place de: "BGA with an organic substrate" "btier BGA organique" comportant un substrat read: lire: “BGA with a rigid organic substrate” “btier BGA comportant un substrat organique rigide” May 2010 Mai 2010 LICENSED TO MECON LIMITED - RANCHI/BANGALORE, FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU 3.1 ball grid array BGA