BS EN 62148-18:2015 BSI Standards Publication Fibre optic active components and devices — Package and interface standards Part 18: 40-Gbit/s serial transmitter and receiver components for use with the LC connector interface BRITISH STANDARD BS EN 62148-18:2015 National foreword This British Standard is the UK implementation of EN 62148-18:2015 It is identical to IEC 62148-18:2014 The UK participation in its preparation was entrusted by Technical Committee GEL/86, Fibre optics, to Subcommittee GEL/86/3, Fibre optic systems and active devices A list of organizations represented on this committee can be obtained on request to its secretary This publication does not purport to include all the necessary provisions of a contract Users are responsible for its correct application © The British Standards Institution 2015 Published by BSI Standards Limited 2015 ISBN 978 580 84231 ICS 33.180.20 Compliance with a British Standard cannot confer immunity from legal obligations This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 January 2015 Amendments/corrigenda issued since publication Date Text affected BS EN 62148-18:2015 EUROPEAN STANDARD EN 62148-18 NORME EUROPÉENNE EUROPÄISCHE NORM January 2015 ICS 33.180.20 English Version Fibre optic active components and devices - Package and interface standards - Part 18: 40-Gbit/s serial transmitter and receiver components for use with the LC connector interface (IEC 62148-18:2014) Composants et dispositifs actifs fibres optiques - Normes de btier et d'interface - Partie 18 : Composants d'émetteurs et de récepteurs série 40 Gbit/s, destinés être utilisés avec les interfaces des connecteurs LC (IEC 62148-18:2014) Aktive Lichtwellenleiterbauelemente und -geräte - Gehäuseund Schnittstellennormen - Teil 18: Serielle Sende- und Empfangsmodule für 40 Gbit/s für Schnittstellen mit LC-Steckverbinder (IEC 62148-18:2014) This European Standard was approved by CENELEC on 2014-12-30 CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member This European Standard exists in three official versions (English, French, German) A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels © 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members Ref No EN 62148-18:2015 E BS EN 62148-18:2015 EN 62148-18:2015 -2- Foreword The text of document 86C/1227/CDV, future edition of IEC 62148-18, prepared by SC 86C "Fibre optic systems and active devices" of IEC/TC 86 "Fibre optics" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62148-18:2015 The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2015-09-30 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2017-12-30 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent rights Endorsement notice The text of the International Standard IEC 62148-18:2014 was approved by CENELEC as a European Standard without any modification In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60191 NOTE Harmonized in EN 60191 series (not modified) IEC 61281-1 NOTE Harmonized as EN 61281-1 IEC 61754-20 NOTE Harmonized as EN 61754-20 ISO 1101 NOTE Harmonized as EN ISO 1101 BS EN 62148-18:2015 EN 62148-18:2015 -3- Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies NOTE When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies NOTE Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication Year Title EN/HD Year IEC 62148-1 - Fibre optic active components and devices Package and interface standards Part 1: General and guidance EN 62148-1 - IEC Guide 107 - Electromagnetic compatibility - Guide to the drafting of electromagnetic compatibility publications - - –2– BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 CONTENTS INTRODUCTION Scope Normative references Terms, definitions and abbreviations 3.1 Terms and definitions 3.2 Abbreviations Electromagnetic compatibility (EMC) requirements Classification Specification of 40-Gbit/s serial transmitter component for LC connectors without thermo-electric cooler 6.1 General 6.2 Electrical interface 6.2.1 General 6.2.2 Numbering of electrical terminals 6.2.3 Electrical terminal assignment 6.3 Outline and footprint 11 6.3.1 Drawing of package outline 11 6.3.2 Drawing of footprint 13 Specification of 40-Gbit/s serial transmitter component for LC connectors with thermo-electric cooler 14 7.1 General 14 7.2 Electrical interface 14 7.2.1 General 14 7.2.2 Numbering of electrical terminals 15 7.2.3 Electrical terminal assignment 16 7.3 Outline and footprint 18 7.3.1 Drawing of package outline 18 7.3.2 Drawing of footprint 20 Specification of 40-Gbit/s serial transmitter component for LC connectors with thermo-electric cooler and built-in driver 21 8.1 General 21 8.2 Electrical interface 21 8.2.1 General 21 8.2.2 Numbering of electrical terminals 22 8.2.3 Electrical terminal assignment 23 8.3 Outline and footprint 25 8.3.1 Drawing of package outline 25 8.3.2 Drawing of footprint 27 Specification of receiver component for LC connectors with PIN 28 9.1 General 28 9.2 Electrical interface 28 9.2.1 General 28 9.2.2 Numbering of electrical terminals 29 9.2.3 Electrical terminal assignment 29 9.3 Outline and footprint 31 BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 –3– 9.3.1 Drawing of package outline 31 9.3.2 Drawing of footprint 33 Bibliography 35 Figure – Electrical terminal numbering assignments Figure – Block diagram Figure – Package outline drawing 11 Figure – Recommended pattern layout for the PCB 13 Figure – Electrical terminal numbering assignments 15 Figure – Block diagram 16 Figure – Package outline 18 Figure – Recommended pattern layout for the PCB 20 Figure – Electrical terminal numbering assignments 22 Figure 10 – Block diagram 23 Figure 11 – Package outline 25 Figure 12 – Recommended pattern layout for the PCB 27 Figure 13 – Electrical terminal numbering assignments 29 Figure 14 – Block diagram 29 Figure 15 – Package outline 31 Figure 16 – Recommended pattern layout for the PCB 33 Table – Terminal function definitions 10 Table – Dimensions of the package outline 12 Table – Dimensions of the recommended pattern layout for the PCB 14 Table – Terminal function definitions 17 Table – Dimensions of the package outline 19 Table – Dimensions of the recommended pattern layout for the PCB 21 Table – Terminal function definitions 24 Table – Dimensions of the package outline 26 Table – Dimensions of the recommended pattern layout for the PCB 28 Table 10 – Terminal function definitions 30 Table 11 – Dimensions of the package outline 32 Table 12 – Dimensions of the recommended pattern layout for the PCB 34 –6– BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 INTRODUCTION Compact optical sub-assembly (OSA) modules for 40 Gbit/s are used to convert electrical signals into optical signals and vice-versa This part of IEC 62148 covers the physical interface for 40-Gbit/s compact OSA modules These modules are designed for use with the LC fibre optic connector specified in IEC 61754-20, and are intended to be applied to 40 Gbit/s or higher bit rate transceivers BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 –7– FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES – PACKAGE AND INTERFACE STANDARDS – Part 18: 40-Gbit/s serial transmitter and receiver components for use with the LC connector interface Scope This part of IEC 62148 covers the 40-Gbit/s serial physical interface specification of transmitter and receiver components for use with the LC connector interface The purpose of this standard is to adequately specify the physical requirements of optical transmitters and receivers that will enable mechanical interchangeability of transmitters and receivers complying with this standard both at the PCB level and for any panel-mounting requirement Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies IEC 62148-1, Fibre optic active components and devices – Package and interface standards – Part 1: General and guidance IEC Guide 107, Electromagnetic compatibility – Guide to the drafting of electromagnetic compatibility publications Terms, definitions and abbreviations For the purposes of this document, the following terms, definitions and abbreviations apply 3.1 Terms and definitions 3.1.1 TOSA module optical module that converts electrical signals into optical signals and that is connected to an optical fibre 3.1.2 ROSA module optical module that converts optical signals into electrical signals and that is connected to an optical fibre 3.2 Abbreviations DML directly modulated laser diode EmwL external modulator with laser diode FPC flexible printed circuit LD laser diode OSA optical sub-assembly –8– PCB printed circuit board PD photodiode ROSA receiver optical sub-assembly TOSA transmitter optical sub-assembly BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 Electromagnetic compatibility (EMC) requirements The components specified in this part of IEC 62148 shall comply with suitable requirements for electromagnetic compatibility (in terms of both, emission and immunity), depending on the particular usage/environment in which they are intended to be installed or integrated Guidance to the drafting of such EMC requirements is provided in IEC Guide 107 Guidance for electrostatic discharge (ESD) is still under study Classification The transmitter and receiver components for the LC connector described in this standard are classified as type according to the definitions of IEC 62148-1 Specification of 40-Gbit/s serial transmitter component for LC connectors without thermo-electric cooler 6.1 General This clause specifies the physical requirements of a TOSA module that will enable mechanical interchangeability of modules complying with this standard, both for the PCB and for any panel mounting requirement The vendor should design the FPC by considering electrical crosstalk and mechanical stress 6.2 6.2.1 Electrical interface General The electrical interface in this standard defines only the basic functionality of each pin 6.2.2 Numbering of electrical terminals Pin numbering assignments are shown in Figure Package potential shall be specified by each vendor FPC 765432 IEC Figure – Electrical terminal numbering assignments – 24 – BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 Table – Terminal function definitions Terminal number Symbol Function D1 TEC+ TEC anode D2 TEC- TEC cathode D3 MON Modulation monitor (optional) D4 VC Waveform control D5 VX Cross point control D6 PDA PD anode D7 LDA LD anode D8 TH Thermistor D9 GND (Option A) Ground (Option A) TH (Option B) Thermistor (Option B ) R1 OP Vendor option (input) R2 VSS Driver IC power supply R3 GND Ground GND R4 IN Data input R5 GND Ground GND R6 INB Inverted data input R7 GND Ground GND R8 VM Modulator modulation R9 VB Modulator bias NOTE The TEC acts as an LD chip cooler in the bias direction described here When it is biased reversely, its function is changed to heating BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 8.3 8.3.1 – 25 – Outline and footprint Drawing of package outline Drawing and dimensions of the package outline are shown in Figure 11 and Table 8, respectively Mechanical reference plane T2 C N Heat radiation plane -A- Optical reference plane E Centreline of datum C T1 F C H 0,05 K DD B A R S Q P U M L 0,025 J 0,025 C D A DE G 0,05 FPC -B- B -C- a DA 12 places DB -AA- Centreline of datum "AA" DC Heat radiation plane 14 places V NOTE a 0,3 AA IEC The attachment structure of the FPC to the TOSA body described here is prepared as an example only Denotes 18 soldering pads corresponding to the terminals described in Figure and Table Features and dimensions of the pads and the FPC end portion shape around the pads shall be specified by each vendor to comply with the recommended pattern layout described in Figure 12 The features of the pads and the FPC end portion shape described in this figure are prepared as examples only Figure 11 – Package outline BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 – 26 – Table – Dimensions of the package outline Dimensions mm Reference Notes Minimum Maximum D – – E 4,0 4,1 F 4,7 5,1 Diameter G 2,98 3,00 Diameter H – 2,97 Diameter J 1,065 1,135 K 0,55 0,70 L 0,52 0,63 M 1,0 – N – 4,1 Diameter P – Note Q 2,6 Note R – 3,8/6,2 (alternative) Note S – Note T1 1,52 – T2 – 26,5 U – V – 6,5 Note Note 3, a a a DA 0,79 Basic dimension, DB 4,74 Reference dimension, DC – b – DD 0,44 0,945 DE 2,5 – a a , Note a NOTE Refer to IEC 61754-20 NOTE Denotes the outline dimension of the TOSA body, including the heat radiation plane, from datum C NOTE Denotes the outline dimension of the FPC from datum C NOTE Denotes the dimension from the centreline of datum C to the centreline of datum AA a The dimensions defined in this table shall be satisfied even if a vendor should choose a different FPC attachment structure or a different FPC end portion shape from those described in Figure 11 b The dimension and the positional tolerance of DC shall be specified by each vendor, considering the recommended pattern layout described in Figure 12 BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 8.3.2 – 27 – Drawing of footprint Drawing and dimensions of the package outline are shown in Figure 12 and Table 9, respectively FQ 0,1 places FA FK FP places 0,1 FJ FA 0,1 FA Mechanical reference plane FM -FA- FF FS #R1 ROSA Centreline of datum C FE #R2 TOSA #R8 FR 0,3 C FG FN FT #R9 -C- FH FD Component keep-out area for FPC attachment Soldering pads corresponding to the terminals on the FPC described in Figure IEC NOTE Datum C described here is the same as described in Figure 11 NOTE #R1, #R2, #R8 and #R9 in this figure denote the pad numbers corresponding to the terminal numbers described in Figure and Table Figure 12 – Recommended pattern layout for the PCB BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 – 28 – Table – Dimensions of the recommended pattern layout for the PCB Dimensions mm Reference Notes Minimum Maximum FD1 29,0 29,7 Applied to RF pin FD2 32,5 33,2 Applied to DC pin FE 0,695 Basic dimension, Note FF 0,50 0,55 FG 1,0 1,1 FH – 2,5 FJ 6,89 7,14 FK 5,24 5,34 FM1 1,0 – Applied to RF pin FM2 1,4 – Applied to DC pin FN 1,0 – FP FQ 0,79 0,45 FR Basic dimension 0,50 4,74 FS 3,75 – Note FT 3,75 – Note NOTE Denotes the offset between datum C and datum FA NOTE Denotes the dimension from datum FA Reference dimension Specification of receiver component for LC connectors with PIN 9.1 General This clause specifies the physical requirements of a ROSA module that will enable mechanical interchangeability of modules complying with this specification, both for the PCB and for any panel mounting requirement The vendor should design the FPC by considering electrical crosstalk and mechanical stress 9.2 9.2.1 Electrical interface General The electrical interface in this specification defines only the basic functionality of each pin Package potential shall be specified by each vendor BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 9.2.2 – 29 – Numbering of electrical terminals Pin numbering assignments are shown in Figure 13 FPC 765432 IEC Figure 13 – Electrical terminal numbering assignments 9.2.3 Electrical terminal assignment Electrical terminal assignment and terminal function definitions are shown in Figure 14 and Table 10, respectively OUT Load V pd V cc OP Z0 OUTB Load Z0 GND IEC NOTE The dashed line denotes a functional boundary between inside and outside component and does not mean electrical connection Figure 14 – Block diagram – 30 – BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 Table 10 – Terminal function definitions Terminal number Symbol Function OP(input) Optional input V cc TIA power supply voltage GND Signal ground OUT/ OUT B Note GND Signal ground OUT B/OUT Note GND Signal ground V pd PD cathode NOTE Symbol OUT means non-inverting output to be terminated with 50 Ω load, and symbol OUT B means inverting output to be terminated with 50 Ω load BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 9.3 9.3.1 – 31 – Outline and footprint Drawing of package outline Drawing and dimensions of the package outline are shown in Figure 15 and Table 11, respectively Denotes a protruding object, for example lead pins, symbolically Mechanical reference plane T C N -A- Optical reference plane L Centreline of datum C M E F H K C 0,05 B A R S Q P DD J 0,025 C U G 0,05 B Centreline of datum AA -B- D FPC DE -C- DA places DB 0,025 A -AA- a DC places V 0,3 AA IEC a Denotes soldering pads corresponding to the terminals described in Figure 13 and Table 10 Features and dimensions of the pads and the FPC end portion shape around the pads shall be specified by each vendor to comply with the recommended pattern layout described in Figure 16 The features of the pads and the FPC end portion shape described in this figure are prepared as examples only Figure 15 – Package outline BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 – 32 – Table 11 – Dimensions of the package outline Dimensions mm Reference Notes Minimum Maximum D – – E 4,0 4,1 F 4,7 5,1 Diameter G 2,98 3,00 Diameter H – 2,97 Diameter J 1,065 1,135 K 0,55 0,70 L 0,52 0,63 M 1,0 - N – 4,1 Diameter P – Note Q – Note R – Note S – Note T – 13 a U – V – 5,7 Note Note 3, b b b) DA 0,79 Basic dimension DB 3,95 Reference dimension DC – – c DD 0,50 0,55 b DE 2,5 – b NOTE Refer to IEC 61754-20 NOTE P, Q, R and S define the maximum dimension; they not specify the shape of the package NOTE Denotes the dimension from the centreline of datum C b a Dimension T shall be specified by each vendor, considering their designed FPC, attachment structure, and the recommended pattern layout described in Figure 16 b The dimensions defined in this table shall be satisfied even if a vendor chooses a different FPC attachment structure or a different FPC end portion shape from those described in Figure 15 c The dimension and the positional tolerance of DC shall be specified by each vendor, considering the recommended pattern layout described in Figure 16 BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 9.3.2 – 33 – Drawing of footprint Drawing and dimensions of the footprint are shown in Figure 16 and Table 12 respectively FQ places -FA- FD 0,1 FA FP places FS FH #2 FF FK FG 0,1 FA FJ 0,1 FA -C- Centreline of datum C #1 ROSA FR 0,3 C #8 FE #7 FT FN FM Mechanical reference plane Component keep-out area for FPC attachment Soldering pads that correspond to the terminals on the FPC described in Figure IEC NOTE Datum C described here is the same as described in Figure 15 NOTE #1, #2, #7 and #8 in this figure denote pad numbers corresponding to the terminal numbers described in Figure 13 and Table 10 Figure 16 – Recommended pattern layout for the PCB BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 – 34 – Table 12 – Dimensions of the recommended pattern layout for the PCB Dimensions mm Reference FD Notes Minimum Maximum 17,7 18,4 FE 0,3 Basic dimension, Note FF 0,50 0,55 FG 1,0 1,1 FH – 2,5 FJ 6,10 6,35 FK 4,45 4,55 FM 1,04 – FN 1,0 – FP FQ 0,79 0,45 FR Basic dimension 0,50 3,95 Reference dimension FS 3,35 – Note FT 3,35 – Note NOTE Denotes the offset between datum C and datum FA NOTE Denotes the dimension from datum FA BS EN 62148-18:2015 IEC 62148-18:2014 © IEC 2014 – 35 – Bibliography IEC 60191 (all parts), Mechanical standardization of semiconductor devices IEC 61281-1, Fibre optic communication subsystems – Part 1: Generic specification IEC 61754-20, Fibre optic interconnecting devices and passive components – Fibre optic connector interfaces – Part 20: Type LC connector family ISO 1101, Geometrical product specifications (GPS) – Geometrical tolerancing – Tolerancing of form, orientation, location and run-out _ This page deliberately left blank This page deliberately left 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