Bsi bs en 60947 7 4 2013

BS EN 60947-7-4:2013 BSI Standards Publication Low-voltage switchgear and controlgear Part 7-4: Ancillary equipment — PCB terminal blocks for copper conductors BRITISH STANDARD BS EN 60947-7-4:2013 National foreword This British Standard is the UK implementation of EN 60947-7-4:2013 It is identical to IEC 60947-7-4:2013 The UK participation in its preparation was entrusted by Technical Committee PEL/17, Switchgear, controlgear, and HV-LV co-ordination, to Subcommittee PEL/17/2, Low voltage switchgear and controlgear A list of organizations represented on this committee can be obtained on request to its secretary This publication does not purport to include all the necessary provisions of a contract Users are responsible for its correct application © The British Standards Institution 2013 Published by BSI Standards Limited 2013 ISBN 978 580 68354 ICS 29.130.20 Compliance with a British Standard cannot confer immunity from legal obligations This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 October 2013 Amendments/corrigenda issued since publication Date Text affected BS EN 60947-7-4:2013 EUROPEAN STANDARD EN 60947-7-4 NORME EUROPÉENNE October 2013 EUROPÄISCHE NORM ICS 29.130.20 English version Low-voltage switchgear and controlgear Part 7-4: Ancillary equipment PCB terminal blocks for copper conductors (IEC 60947-7-4:2013) Appareillage basse tension Partie 7-4: Matériels accessoires Blocs de jonction pour cartes de circuits imprimés pour conducteurs en cuivre (CEI 60947-7-4:2013) Niederspannungsschaltgeräte Teil 7-4: Hilfseinrichtungen Leiterplatten-Anschlussklemmen für Kupferleiter (IEC 60947-7-4:2013) This European Standard was approved by CENELEC on 2013-09-10 CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member This European Standard exists in three official versions (English, French, German) A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels © 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members Ref No EN 60947-7-4:2013 E BS EN 60947-7-4:2013 EN 60947-7-4:2013 -2- Foreword The text of document 17B/1822/FDIS, future edition of IEC 60947-7-4, prepared by SC 17B “Low-voltage switchgear and controlgear” of IEC/TC 17 “Switchgear and controlgear" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60947-7-4:2013 The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2014-06-10 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2016-09-10 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent rights Endorsement notice The text of the International Standard IEC 60947-7-4:2013 was approved by CENELEC as a European Standard without any modification In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60512-5-1 NOTE Harmonized as EN 60512-5-1 IEC 60512-9-5 NOTE Harmonized as EN 60512-9-5 IEC 60529 NOTE Harmonized as EN 60529 IEC 60664-1:2007 NOTE Harmonized as EN 60664-1:2007 (not modified) IEC 60695-2-10 NOTE Harmonized as EN 60695-2-10 IEC 60695-10-2 NOTE Harmonized as EN 60695-10-2 IEC 60695-11-5 NOTE Harmonized as EN 60695-11-5 IEC 60998-1:2002 NOTE Harmonized as EN 60998-1:2004 (modified) IEC 61984 NOTE Harmonized as EN 61984 BS EN 60947-7-4:2013 EN 60947-7-4:2013 -3- Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies Publication Year Title EN/HD Year IEC 60068-2-20 - Environmental testing EN 60068-2-20 Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads - IEC 60352-1 - Solderless connections Part 1: Wrapped connections - General requirements, test methods and practical guidance EN 60352-1 - IEC 60352-2 - Solderless connections Part 2: Crimped connections - General requirements, test methods and practical guidance EN 60352-2 - IEC 60352-3 - Solderless connections Part 3: Solderless accessible insulation displacement connections - General requirements, test methods and practical guidance EN 60352-3 - IEC 60352-4 - Solderless connections EN 60352-4 Part 4: Solderless non-accessible insulation displacement connections - General requirements, test methods and practical guidance - IEC 60352-5 - Solderless connections Part 5: Press-in connections - General requirements, test methods and practical guidance EN 60352-5 - IEC 60352-6 - Solderless connections Part 6: Insulation piercing connections General requirements, test methods and practical guidance EN 60352-6 - IEC 60352-7 - Solderless connections EN 60352-7 Part 7: Spring clamp connections - General requirements, test methods and practical guidance - IEC 60512-2-1 - Connectors for electronic equipment - Tests EN 60512-2-1 and measurements Part 2-1: Electrical continuity and contact resistance tests - Test 2a: Contact resistance - Millivolt level method - BS EN 60947-7-4:2013 EN 60947-7-4:2013 -4- Publication Year Title EN/HD Year IEC 60512-4-1 - Connectors for electronic equipment - Tests EN 60512-4-1 and measurements Part 4-1: Voltage stress tests - Test 4a: Voltage proof - IEC 60512-5-2 - Connectors for electronic equipment - Tests EN 60512-5-2 and measurements Part 5-2: Current-carrying capacity tests Test 5b: Current-temperature derating - IEC 60512-11-7 - Connectors for electronic equipment - Tests EN 60512-11-7 and measurements Part 11- 7: Climatic tests - Test 11g: Flowing mixed gas corrosion test - IEC 60512-11-9 - Connectors for electronic equipment - Tests EN 60512-11-9 and measurements Part 11-9: Climatic tests - Test 11i: Dry heat - IEC 60512-11-10 - Connectors for electronic equipment - Tests EN 60512-11-10 and measurements Part 11-10: Climatic tests - Test 11j: Cold - IEC 60695-2-11 - Fire hazard testing Part 2-11: Glowing/hot-wire based test methods - Glow-wire flammability test method for end-products EN 60695-2-11 - IEC 60695-2-12 - Fire hazard testing Part 2-12: Glowing/hot-wire based test methods - Glow-wire flammability index (GWFI) test method for materials EN 60695-2-12 - IEC 60695-2-13 - Fire hazard testing Part 2-13: Glowing/hot-wire based test methods - Glow-wire ignition temperature (GWIT) test method for materials EN 60695-2-13 - IEC 60947-1 + A1 2007 2010 Low-voltage switchgear and controlgear Part 1: General rules EN 60947-1 + A1 2007 2011 IEC 60998-2-3 - Connecting devices for low-voltage circuits EN 60998-2-3 for household and similar purposes Part 2-3: Particular requirements for connecting devices as separate entities with insulation-piercing clamping units - IEC 60999-1 - Connecting devices - Electrical copper EN 60999-1 conductors - Safety requirements for screwtype and screwless-type clamping units Part 1: General requirements and particular requirements for clamping units for conductors from 0,2 mm² up to 35 mm² (included) - IEC 60999-2 - Connecting devices - Electrical copper EN 60999-2 conductors - Safety requirements for screwtype and screwless-type clamping units Part 2: Particular requirements for clamping units for conductors above 35 mm² up to 300 mm² (included) - IEC 61210 - Connecting devices - Flat quick-connect EN 61210 terminations for electrical copper conductors - Safety requirements - BS EN 60947-7-4:2013 EN 60947-7-4:2013 -5- Publication Year Title EN/HD ISO 6988 - Metallic and other non-organic coatings EN ISO 6988 Sulfur dioxide test with general condensation of moisture Year - –2– BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 CONTENTS INTRODUCTION General 1.1 Scope 1.2 Normative references Terms and definitions Classification 10 Characteristics 10 4.1 4.2 4.3 Summary of characteristics 10 Type of PCB terminal block 10 Rated and limiting values 10 4.3.1 Rated voltages 10 4.3.2 Rated current 10 4.3.3 Standard cross-sections 10 4.3.4 Maximum cross-section 11 4.3.5 Connecting capacity 11 Product information 12 5.1 Marking 12 5.2 Additional information 13 Normal service, mounting and transport conditions 13 Constructional and performance requirements 13 7.1 Constructional requirements 13 7.1.1 Clamping units 13 7.1.2 Mounting and installation 14 7.1.3 Clearances and creepage distances 14 7.1.4 Terminal identification and marking 14 7.1.5 Resistance to abnormal heat and fire 15 7.1.6 Maximum cross-section and connecting capacity 15 7.2 Performance requirements 15 7.2.1 Temperature rise 15 7.2.2 Dielectric properties 15 7.2.3 Short-time withstand current 15 7.2.4 Contact resistance 16 7.2.5 Ageing test (climatic sequence and corrosion test) 16 7.3 Electromagnetic compatibility (EMC) 16 Tests 16 8.1 8.2 8.3 8.4 Kinds of test 16 General 16 Verification of mechanical characteristics 17 8.3.1 General 17 8.3.2 Attachment of the PCB terminal block on its support 17 8.3.3 Vacant 17 8.3.4 Verification of the maximum cross-section and connecting capacity 17 8.3.5 Verification of maximum cross-section (special test with gauges) 17 Verification of electrical characteristics 17 8.4.1 General 17 BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 –3– 8.4.2 Verification of clearances and creepage distances 18 8.4.3 Dielectric tests 18 8.4.4 Verification of contact resistance 19 8.4.5 Temperature rise test 20 8.4.6 Short-time withstand current test 22 8.4.7 Ageing test (climatic sequence and corrosion test) 23 8.5 Verification of thermal characteristics 24 8.6 Verification of EMC characteristics 25 8.6.1 General 25 8.6.2 Immunity 25 8.6.3 Emission 25 Annex A (informative) Structure of a PCB terminal block 26 Annex B (informative) Additional Information to be specified between manufacturer and user 27 Annex C (informative) Examples of PCBs and PCB terminal blocks for high current application 28 Bibliography 30 Figure – Test assembly for the measurement of contact resistance and temperature rise 20 Figure – Example of wiring structure of a multi-tier PCB terminal block 21 Figure – Test assembly for the measurement of short-time withstand current 23 Figure – Test sequence 24 Figure A.1 – Structure of a PCB terminal block 26 Figure C.1 – Structure of a high current PCB 28 Figure C.2 – PCB terminal block with soldered connection to the PCB 28 Figure C.3 – PCB terminal block with screwed connection to the PCB 29 Table – Standard cross-sections of copper conductors 11 Table – Relationship between maximum cross-section and connecting capacity of PCB terminal blocks 12 Table – Standards for clamping units and connecting methods 14 Table – Impulse withstand test voltages 19 Table – Dielectric test voltages corresponding to the rated insulation voltage 19 Table – Length of connectable conductors and conductor loops 21 Table – Examples of cross-sectional distribution of interconnections on printed circuit boards 22 –6– BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 INTRODUCTION This standard IEC 60947-7-4 for PCB terminal blocks covers not only the terminal block requirements according to IEC 60947-7 series but also takes into account the specifications of connectors according to IEC 61984 as the requirements for both components are highly similar due to equivalent applications – 18 – – dielectric tests (see 8.4.3); – verification of the contact resistance (see 8.4.4); – temperature rise test (see 8.4.5); – short-time withstand current test (see 8.4.6); – ageing test (see 8.4.7) 8.4.2 8.4.2.1 BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 Verification of clearances and creepage distances General The verification is made between two adjacent PCB terminal blocks or mutually insulated contact units of a multipole PCB terminal block and all live parts and accessible metal parts of a PCB terminal block The measurement of clearances and creepage distances shall be made under the following conditions: a) the PCB terminal blocks shall be connected with the most unfavourable conductor type(s) and conductor cross-section(s) among those declared by the manufacturer or without a conductor, if this turns out to be the most unfavourable case; b) the conductor ends shall be stripped, if required, to a length specified by the manufacturer The method of measuring clearances and creepage distances is described in annex G of IEC 60947-1:2007 8.4.2.2 Clearances The measured values of clearances shall be higher than the values given in Table 13 of IEC 60947-1:2007 for case B – homogeneous field (see 7.2.3.3 of IEC 60947-1:2007) based on the value of the rated impulse withstand voltage (U imp ) and the pollution degree stated by the manufacturer The impulse withstand voltage test shall be carried out in accordance with 8.4.3 a) unless the measured clearances are equal to or larger than the values given in Table 13 of IEC 60947-1:2007 for case A – inhomogeneous field (see 8.3.3.4.1, item 2), of IEC 60947-1:2007, Amendment (2010)) 8.4.2.3 Creepage distances The measured creepage distances shall be not less than the values given in Table 15 of IEC 60947-1:2007, Amendment (2010) in connection with 7.2.3.4 a) and b) of IEC 60947-1:2007 based on the rated insulation voltage (U i ), the material group and the pollution degree as specified by the manufacturer 8.4.3 Dielectric tests a) If the manufacturer has declared a value for the rated impulse withstand voltage (U imp ), the impulse withstand voltage test shall be carried out in accordance with Table b) The power-frequency withstand verification of solid insulation according to IEC 60512-4-1 shall be made in accordance with the test voltages given in Table For this test, the PCB terminal blocks are connected with the most unfavourable conductor (without a printed circuit board) The duration of the test is The test voltage shall be applied between each of the poles which can assume different potentials in the application NOTE The relationship between nominal voltages and of the rated impulse withstand voltage (U imp ) are given in Annex H of IEC 60947-1:2007 (see also 7.1.3) A voltage dip of the test voltage or a disruptive discharge or flashover is not allowed BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 – 19 – Table – Impulse withstand test voltages Impulse withstand voltage a a Rated impulse voltage for a height of 000 m above sea level at sea level kV kV (1,2/50 µs) kV (1,2/50 µs) 0,5 0,5 0,55 0,8 0,8 0,91 1,5 1,5 1,75 2,5 2,5 2,95 4 4,8 6 7,3 8 9,8 12 12 14,8 If the testing laboratory is situated at a height between sea level and 000 m, interpolation of the impulse voltage is allowed Table – Dielectric test voltages corresponding to the rated insulation voltage A.C test voltage (r.m.s.) a Rated insulation voltage a Ui Overvoltage category III Overvoltage category II V kV kV U i ≤ 63 0,5 0,4 63 < U i ≤ 100 0,8 0,5 100 < U i ≤ 160 1,4 0,8 160 < U i ≤ 320 2,2 1,4 320 < U i ≤ 500 3,1 2,2 500 < U i ≤ 000 4,2 3,1 R.M.S test voltages are based on 6.1.3.4 of IEC 60664-1:2007 and are higher than those of IEC 60947-1:2007, Table 12A in order to be in line with requirements of end-product standards 8.4.4 Verification of contact resistance The contact resistance shall be verified: a) before and after the test of attachment of the PCB terminal block on its support (see 8.3.2); b) before and after the temperature rise test (see 8.4.5); c) before and after the short-time withstand current test (see 8.4.6); d) before, during and after the ageing test (see 8.4.7) The verification is made as specified in 8.3.2, 8.4.5, 8.4.6 and 8.4.7 The contact resistance shall be measured between the connected conductor and the interconnection on the printed circuit board at each contact unit of a PCB terminal block as shown in Figure The measurement is carried out according to the procedure specified in IEC 60512-2-1 After the tests a), b), c) and d) the contact resistance shall not rise by more than 50 % of the initial measurement value – 20 – BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 If the measurement value exceeds 1,5 times the initial measurement value, the clamping units and the connecting methods may be evaluated separately Dimensions in mm IEC 1957/13 Key I Test current mV Voltmeter n Number of connections to the printed circuit board per contact unit CC Trace on the printed circuit board for interconnection A max Maximum cross-section in mm Figure – Test assembly for the measurement of contact resistance and temperature rise 8.4.5 Temperature rise test This test serves to evaluate the ability of the PCB terminal block to carry the rated current permanently without exceeding the upper limiting temperature (ULT) Unless otherwise specified, the test shall be carried out according to IEC 60512-5-2 under the following test conditions The test is carried out on an assembly of PCB terminal blocks mounted next to each other with preferably four contact units per level as shown in Figure and Figure The PCB terminal block shall be mounted on a printed circuit board as in normal use and connected in series with insulated conductors of the maximum cross-section and conductors on the printed circuit board The interconnections on the printed circuit board shall be made with solid bare conductors of equal cross-section or comparable means and as short as possible BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 – 21 – IEC 1958/13 Figure – Example of wiring structure of a multi-tier PCB terminal block The tightening torque for PCB terminal blocks with screw-type clamping units shall be in accordance with Table of IEC 60947-1:2007 or alternatively with a higher value as specified by the manufacturer The length of connectable conductors and conductor loops shall be taken from Table Table – Length of connectable conductors and conductor loops Cross-section Length mm mm ≤ 10 500 ± 50 16 to 35 000 ± 100 > 35 000 ± 200 For PCB terminal blocks having/providing several connections to the printed circuit board the cross-section of interconnections A B shall be calculated according to the following equation: AB ≤ Amax n where AB is the cross-section of interconnections in mm A max the maximum cross-section in mm and n the number of connections to the printed circuit board per contact unit The sum of cross-sections of interconnections (A B × n) shall not exceed the cross-section of the connectable conductor Examples are given in Table BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 – 22 – Table – Examples of cross-sectional distribution of interconnections on printed circuit boards Maximum cross-section (A max ) mm Number of connections to printed circuit board (n) Cross-section of interconnections (A B ) mm … … … … … 2,5 2,5 0,75 0,5 4 1,5 1 6 2,5 1,5 1,5 10 10 2,5 2,5 … … … … … The test assembly shall be prepared and arranged for the test procedure as shown in Figure according to the test conditions described in IEC 60512-5-2, Test 5b Unless otherwise specified, the size of the printed circuit board shall be selected so that it protrudes over the base area of the PCB terminal block on all sides corresponding to five times the spacing of the PCB terminal block The printed circuit board that is used shall be described in the test report After verification of the contact resistance as described in 8.4.4, the test shall be carried out with single-phase alternating or direct current as described in IEC 60512-5-2, Test 5b As described in IEC 60512-5-2, the measuring points for measuring the temperature shall be located on the hottest spot above the printed circuit board (component side) Where applicable it may be necessary to determine the hottest spot by carrying out pre-tests The reduction factor to determine the derating curve is 0,8 If this is not adhered to, the derating factor used shall be indicated in the technical documentation At the end of the test and after cooling down to ambient temperature the PCB terminal block shall comply with the contact resistance test according to 8.4.4 without modification of the assembly 8.4.6 Short-time withstand current test The purpose of this test is to verify the ability to withstand a thermal shock The test is carried out on two adjacent contact units with the longest and most unfavourable current paths of one PCB terminal block or two adjacent PCB terminal blocks For this test, the PCB terminal block is mounted as in normal use according to the manufacturer’s instructions and connected with conductors of maximum cross-section A max and interconnections A B as determined in 8.4.5 (see Figure 3) The tightening torque for PCB terminal blocks with screw-type clamping units shall be in accordance with Table of IEC 60947-1:2007 or alternatively with a higher value as specified by the manufacturer At the end of the test, the test (circuit) assembly shall show no interruptions and the PCB terminal blocks shall be free from cracks, ruptures or other critical damage BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 – 23 – After cooling down to room temperature the contact units shall comply with the contact resistance test according to 8.4.4 Dimensions in mm IEC 1959/13 Key I Test current mV Voltmeter n Number of connections to the printed circuit board per contact unit CC Trace on the printed circuit board for interconnection A max Maximum cross-section in mm Figure – Test assembly for the measurement of short-time withstand current 8.4.7 Ageing test (climatic sequence and corrosion test) The purpose of this test is to verify that clamping units and connections to the printed circuit board are able to withstand environmental conditions and ageing The test sequence is carried out on a set of PCB terminal blocks each connected with conductors of the minimum and maximum cross-section Attachment of the terminal block to the PCB shall be made according to the manufacturer’s instructions The tests are carried out on prepared specimens in the indicated test sequence (see Figure 4) – 24 – BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 Contact resistance – initial measurement (8.4.4) Cold storage in accordance with IEC 60512-11-10, Test 11j Test temperature: lower limiting temperature of the specimen Test duration: h Dry heat in accordance with IEC 60512-11-9, Test 11i Test temperature: upper limiting temperature of the specimen Test duration: 168 h alternative Test: sulphur dioxide with general condensation in accordance with ISO 6988 Severity: KFW 0,2 S Test duration: 24 h (1 test cycle) Test: flowing mixed gas in accordance with IEC 60512-11-7, Test 11g Contact resistance – final measurement (8.4.4) alternative Test: impulse withstand voltage (8.4.3 a)) Test: dielectric strength (8.4.3 b)) Figure – Test sequence IEC 1960/13 After each test step, except after the contact resistance measurement, the specimens shall be subjected to visual inspection where the PCB terminal blocks shall be free from cracks, ruptures or other critical damage 8.5 Verification of thermal characteristics The thermal characteristics are checked by the glow wire test NOTE The tests are not carried out on parts of ceramic material BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 – 25 – The test is carried out according to IEC 60695-2-10 under following conditions: – on parts of insulating materials necessary to retain current-carrying parts in position and on parts of the protective conductor circuit at a test temperature of 850 °C; – on parts of insulating materials necessary for the proper functioning of the PCB terminal block at a test temperature of 650 °C If the tests are to be made at more than one place on the same sample, it shall be ensured that any deterioration caused by previous tests does not affect the test to be made The test is carried out on a single specimen In case of doubt the test shall be repeated on two other specimens which shall then comply with the repeated test The test is being carried out by applying the glow-wire for one time for s with a tolerance of – 0/+1 s During the test, the specimen shall be placed in the most unfavourable position of normal use, with the surface to be tested in the vertical position The tip of the glow-wire shall be applied to the specified surface of the specimen, taking account of the conditions of normal use, under which a heated or glowing object may be in contact with the specimen The test specimen is considered to have passed the glow-wire test if there is no flaming or glowing, or if all of the following situations apply: a) if flames or glowing of the test specimen extinguish within 30 s after removal of the glowwire, i.e t e ≤ t a + 30 s; and b) when the specified layer of wrapping tissue is used there shall be no ignition of the wrapping tissue 8.6 8.6.1 Verification of EMC characteristics General Subclause 8.4 of IEC 60947-1:2007 applies with the following addition 8.6.2 Immunity PCB terminal blocks within the scope of this standard are not sensitive to electromagnetic disturbances and therefore no immunity tests are necessary 8.6.3 Emission PCB terminal blocks within the scope of this standard not generate electromagnetic disturbances and therefore no emission tests are necessary BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 – 26 – Annex A (informative) Structure of a PCB terminal block The structure of a PCB terminal block consists of an insulation body and one or more contact units (see also Figure A.1) Contacts unit(s) Solder pin/pad or equivalent Current bar(s) Clamping unit(s) Insulation body PCB terminal block IEC 1961/13 Figure A.1 – Structure of a PCB terminal block BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 – 27 – Annex B (informative) Additional Information to be specified between manufacturer and user B.1 Additional information available on request of the user In addition to the product information as described in Clause 5, the following items are subject to agreement between manufacturer and user: • additional derating curves according to IEC 60512-5-2, test 5b; • glow-wire flammability test method for end-products according to IEC 60695-2-11; • glow-wire flammability index (GWFI) of PCB terminal block materials according to IEC 60695-2-12; • needle flame test according to IEC 60695-11-5; • ball pressure test according to IEC 60695-10-2 NOTE For the purpose of this annex, the word “agreement” is used in a very wide sense and the word “user” includes testing stations B.2 Information for testing additional to those mentioned above • Insulating material group (CTI value) of the insulating material It is recommended to check the insulating material group by the PTI value; • Relevant detail specification, if available, for example loaded temperature according to IEC 60512-9-5, Test 9e; • Tests for T-classified PCB terminal blocks according to IEC 60998-1:2002, Clause 12 BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 – 28 – Annex C (informative) Examples of PCBs and PCB terminal blocks for high current application C.1 Layout of high current PCBs (schematic diagram) The PCB terminal blocks for high current applications are commonly used in combination with suitable high current printed circuit boards (see Figure C.1) Possible connection methods to the PCB are soldering and screwing (see Figure C.2 and Figure C.3) IEC 1962/13 Key A B C D E conductive layer base material conductive inlay SMD component through connection Figure C.1 – Structure of a high current PCB C.2 High current PCB terminal blocks IEC 1963/13 Key A B C D PCB PCB terminal block connection according to 7.1.2 SMD component Figure C.2 – PCB terminal block with soldered connection to the PCB BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 – 29 – IEC 1964/13 Key A PCB B PCB terminal block C connection according to 7.1.2 D SMD component Figure C.3 – PCB terminal block with screwed connection to the PCB – 30 – BS EN 60947-7-4:2013 60947-7-4 © IEC:2013 Bibliography IEC 60512-5-1, Connectors for electronic equipment – Tests and measurements – Part 5-1: Current-carrying capacity tests – Test 5a: Temperature rise IEC 60512-9-5, Connectors for electronic equipment – Tests and measurements – Part 9-5: Endurance tests – Test 9e: Current loading, cyclic IEC 60529, Degrees of protection provided by enclosures (IP Code) IEC 60664-1:2007, Insulation coordination for equipment within low-voltage systems – Part 1: Principles, requirements and tests IEC 60695-2-10, Fire hazard testing – Part 2-10: Glowing/hot-wire based test methods – Glow-wire apparatus and common test procedure IEC 60695-10-2, Fire hazard testing – Part 10-2: Abnormal heat – Ball pressure test IEC 60695-11-5, Fire hazard testing – Part 11-5: Test flames – Needle-flame test method – Apparatus, confirmatory test arrangement and guidance IEC 60998-1:2002, Connecting devices for low-voltage circuits for household and similar purposes – Part 1: General requirements IEC 61984, Connectors – Safety requirements and tests _ This page deliberately left blank NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW British Standards Institution (BSI) BSI is the national body responsible for preparing British Standards and other standards-related publications, information and services BSI is incorporated by Royal Charter British Standards and other standardization products are published by BSI Standards Limited About us Revisions We bring together business, industry, government, consumers, innovators and 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