Bsi bs en 60191 6 2009

Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 BS EN 60191-6:2009 BSI Standards Publication Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW raising standards worldwide™ BRITISH STANDARD BS EN 60191-6:2009 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 National foreword This British Standard is the UK implementation of EN 60191-6:2009 It is identical to IEC 60191-6:2009 It supersedes BS EN 60191-6:2004 which is withdrawn The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors A list of organizations represented on this committee can be obtained on request to its secretary This publication does not purport to include all the necessary provisions of a contract Users are responsible for its correct application © BSI 2010 ISBN 978 580 59338 ICS 31.080.01 Compliance with a British Standard cannot confer immunity from legal obligations This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 April 2010 Amendments issued since publication Amd No Date Text affected BS EN 60191-6:2009 EUROPEAN STANDARD EN 60191-6 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 NORME EUROPÉENNE December 2009 EUROPÄISCHE NORM ICS 31.080.01 Supersedes EN 60191-6:2004 English version Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009) Normalisation mécanique des dispositifs semi-conducteurs Partie 6: Règles générales pour la préparation des dessins d'encombrement des btiers pour dispositifs semi-conducteurs pour montage en surface (CEI 60191-6:2009) Mechanische Normung von Halbleiterbauelementen Teil 6: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen (IEC 60191-6:2009) This European Standard was approved by CENELEC on 2009-12-01 CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member This European Standard exists in three official versions (English, French, German) A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung Central Secretariat: Avenue Marnix 17, B - 1000 Brussels © 2009 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members Ref No EN 60191-6:2009 E BS EN 60191-6:2009 EN 60191-6:2009 -2- Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 Foreword The text of document 47D/736/CDV, future edition of IEC 60191-6, prepared by SC 47D, Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6 on 2009-12-01 This European Standard supersedes EN 60191-6:2004 EN 60191-6:2009 includes the following significant changes with respect to EN 60191-6:2004: − scope is modified to cover all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8; − editorial modifications on several pages; and − technical revision to ball grid array package (BGA) especially its geometrical drawing format (two types of BGA would unify as one type as a result of revising drawing format.) The following dates were fixed: – latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2010-09-01 – latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2012-12-01 Annex ZA has been added by CENELEC Endorsement notice The text of the International Standard IEC 60191-6:2009 was approved by CENELEC as a European Standard without any modification In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60191-3 NOTE Harmonized as EN 60191-3:1999 (not modified) ISO 2692 NOTE Harmonized as EN ISO 2692:2006 (not modified) BS EN 60191-6:2009 EN 60191-6:2009 -3- Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this document For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies Publication Year Title IEC 60191-1 2007 Mechanical standardization of semiconductor EN 60191-1 devices Part 1: General rules for the preparation of outline drawings of discrete devices 2007 IEC 60191-4 A1 A2 1999 2001 2002 Mechanical standardization of semiconductor EN 60191-4 A1 devices Part 4: Coding system and classification into A2 forms of package outlines for semiconductor device packages 1999 2002 2002 ISO 1101 2004 Geometrical Product Specifications (GPS) - EN ISO 1101 Geometrical tolerancing - Tolerances of form, orientation, location and run-out 2005 EN/HD Year BS EN 60191-6:2009 –2– 60191-6 © IEC:2009 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 CONTENTS Scope .6 Normative references .6 Terms and definitions .6 Design rules .7 Dimensions to be specified .8 Notes .8 Annex A (informative) Illustration of the rules 12 Annex B (informative) Optional table format 36 Bibliography 38 Figure A.1 – Illustrations of terminal projection zone 13 Figure A.2 – Isometric view of an example of gauge 13 Figure A.3a – Top view 14 Figure A.3b – Side view 14 Figure A.3c – Lead section 14 Figure A.3d – Lead side view 14 Figure A.4 – Pattern of terminal position areas 14 Figure A.5a – Top view 17 Figure A.5b – Side view 17 Figure A.5c – Lead section 17 Figure A.5d – Lead side view 17 Figure A.6 – Pattern of terminal position areas 17 Figure A.7a – Top view 20 Figure A.7b – Side view 20 Figure A.7c – Lead section 20 Figure A.7d – Lead side view 20 Figure A.8 – Pattern of terminal position areas 20 Figure A.9a – Top view 23 Figure A.9b – Side view 23 Figure A.9c – Side view 23 Figure A.9d – Lead shape 23 Figure A.9e – Lead side view 23 Figure A.9f – Lead section 23 Figure A.10 – Pattern of terminal position areas 23 Figure A.11a – Top view 26 Figure A.11b – Side view 26 Figure A.11c – Side view 26 Figure A.11d – Lead section 27 Figure A.11e – Lead shape 27 Figure A.11f – Lead side view 27 BS EN 60191-6:2009 60191-6 © IEC:2009 –3– Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 Figure A.12 – Pattern of terminal position areas 27 Figure A.13a – Top View 30 Figure A.13b – Side View 30 Figure A.13c – Bottom view 30 Figure A.14 – Pattern of terminal position areas 30 Figure A.15a – Top view 33 Figure A.15b – Side view 33 Figure A.15c – Bottom view 33 Figure A.16 – Pattern of terminal position areas 33 Table – Dimensions to be specified for Group Table – Dimensions to be specified for Group 10 BS EN 60191-6:2009 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 –6– 60191-6 © IEC:2009 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Scope This part of IEC 60191 gives general rules for the preparation of outline drawings of surfacemounted semiconductor devices It supplements IEC 60191-1 and IEC 60191-3 It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause of IEC 60191-4 Normative references The following referenced documents are indispensable for the application of this document For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies IEC 60191-1:2007, Mechanical standardization of semiconductor devices – Part 1: General rules for the preparation of outline drawings of discrete devices IEC 60191-4:2002, Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages ISO 1101:2004 Geometrical Product Specifications (GPS) – Geometrical tolerancing – Tolerances of form, orientation, location and run-out Terms and definitions For the purposes of this document, the following terms and definitions apply 3.1 seating plane plane which designates the plane of contact of the package, including any stand-off, with the surface on which it will be mounted NOTE This plane is often used as the reference plane 3.2 reference plane plane parallel to the seating plane at a distance A3 above seating plane (does not apply to leadless package) NOTE The distance A3 is known as the reference plane distance It determines the terminal projection zone (see Figure 1) NOTE This distance is a theoretical dimension which is not related to any feature of the package Its value is chosen for each package so the length of terminal projection zone L p is a good approximation of the terminal length used for mounting, e.g the length of the part of the terminal that is soldered to the substrate BS EN 60191-6:2009 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 60191-6 © IEC:2009 –7– 3.3 terminal position area maximum area on the seating plane within which the terminal projection zone is located, taking into account the maximum values of L p and b p NOTE The surface of the terminal position area is equal to l × b with, generally l = L p max + (HDmax – HDmin.)/2 = L p max + (HEmax – HEmin.)/2 and b = b p max + x NOTE Checking can be carried out by means of an appropriate gauge (see Figure 2) 3.4 pattern of terminal position areas group of all terminal position areas of a leaded package or folded lead package in the seating plane NOTE For a leadless package, it is the projection of its metallized pads or terminals on the seating plane NOTE The true positions of the centres of the terminal position areas are located on a grid with a modulus e / eD or e / eE NOTE The pattern of terminal position areas does not include tolerances stemming from mounting substrates (printed board) design and placement machine accuracy 3.5 coplanarity of terminals profile tolerance controlling the location of the crowns of the bottom terminals with respect to the seating plane NOTE In all the other cases, the requirement for coplanarity of terminals is clarified by a note 3.6 datum geometrical established planes for controlling the tolerance zone NOTE Datum S should be established by seating plane Design rules The outline drawing of a surface-mounted semiconductor device package shall comprise in the given sequence: – the drawing (strictly speaking); – the tables of dimensions; – the notes to the tables and the drawings; – the codification The drawing shall conform with the general rules for drawings laid down in IEC 60191-1, Clause and Clause 5, as well as with the specific definitions of Clause above The following, Clause and Clause give, respectively, the tables of dimensions to be specified and the notes to be called, where relevant Supplementary dimensions and notes may be added when required BS EN 60191-6:2009 60191-6 © IEC:2009 –8– Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 The codification of package outlines shall be in accordance with IEC 60191-4 Dimensions to be specified Crosses in the Table and Table indicate where values have to be specified In the auxiliary right-hand column, a code indicates for which outline families each dimension is generally relevant, as follows: L: F: P: B: leaded packages folded lead packages leadless packages ball grid array packages packages packages packages packages with with with with gull-wing leads J-bent leads no leads ball leads for for for for example; example; example; example; QFP, SOP,TSOP QFJ, SOJ QFN BGA Notes Notes referred to in the tables and in the drawings appear after Table 2; in the auxiliary righthand column, a code indicates for which outline families each note is generally relevant (with the same code as in Clause above) For each particular outline package or package family, the applicable notes shall be numbered sequentially from in the order they are in the tables and then on the drawing BS EN 60191-6:2009 60191-6 © IEC:2009 – 26 – J-bend lead package with one row of terminals on each of four sides (QFJ) L D ZD ZE C eE B A Terminal index area HE e n A1 A2 A HD IEC 2266/09 IEC 2265/09 Figure A.11a – Top view Figure A.11b – Side view h E Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 A.6 Seating plane bp x M P S A-B C y S S eD IEC 2267/09 Figure A.11c – Side view Date 2009 BS EN 60191-6:2009 – 27 – L2 b2 P A3 bp c L1 b1 c1 Figure A.11d – Lead section Lp bp IEC 2268/09 t M P S A-B IEC 2269/09 Figure A.11e – Lead shape e C IEC 2270/09 Figure A.11f – Lead side view eE b3 l1 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 60191-6 © IEC:2009 eD IEC 2271/09 Figure A.12 – Pattern of terminal position areas Date 2009 BS EN 60191-6:2009 60191-6 © IEC:2009 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 – 28 – Group includes dimensions and numerals associated with the mounting of packages and kinds of packages The dimensions and numerals belonging to the group mean values guaranteed to users and imply that mechanical compatibility of mounting of packages can be recognized Ref Min Nom Max Notes n - x - nD - x - nE - x - A - - x A1 x - x A2 - x - A3 - x(∗) - bp x - x c x - x D x x x E x x x e - x(∗) - HD x x x HE x x x Lp x - x t - - x x - - x y - - x 4 Group includes dimensions that not belong to Group 1, but are associated with the fabrication of packages and dimensions of terminal position areas The group is to achieve its own original purpose as an industry standard The group belongs to the dimensions and numerals of external shapes of packages useful for design and manufacture and the dimensions of terminal position areas that can be referenced to in fabrications of mounting boards Therefore, external dimensions of a package shall have nominal design values specified thereto Ref Min Nom Max b1 - x - b2 x - x b3 - - x c1 - x - eD - x - eE - x - L - x - L1 - x - L2 - x - l1 - - x h - x - ( ZD ) - x - ( ZE ) - x - Notes 4 BS EN 60191-6:2009 60191-6 © IEC:2009 – 29 – Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 Explanation of the symbols (∗) means true geometrical position [] values given within square brackets are calculated values P means projected tolerance zone (see ISO 1101, Clause 13) y S means in this drawing that the distance from the seating plane to the nearest point of each terminal should not exceed y mm NOTES The millimetre (inch) dimensions are derived from the original inch (millimetre) dimensions n refers to the total number of terminal positions nD refers to the number of terminal positions on one side of the package in the direction of dimension D nE refers to the number of terminal positions on one side of the package in the direction of dimension E Check of the dimensions and positions of package terminal is validly performed when it is ensured that these terminal fit with the pattern of terminal position areas This can be carried out by means of an appropriate gauge BS EN 60191-6:2009 60191-6 © IEC:2009 – 30 – Leadless package E Terminal index area Seating plane A S y S IEC 2273/09 IEC 2272/09 Figure A.13a – Top View Figure A.13b – Side View E ZE k D B A C ZD e NOTE k1 x M S A-B C Lp bp IEC 2274/09 Figure A.13c – Bottom view e eE b3 eD D Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 A.7 e l1 IEC 2275/09 Figure A.14 – Pattern of terminal position areas Date 2009 BS EN 60191-6:2009 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 60191-6 © IEC:2009 – 31 – Group includes dimensions and numerals associated with the mounting of packages and kinds of packages The dimensions and numerals belonging to the group mean values guaranteed to users and imply that mechanical compatibility of mounting of packages can be recognized Ref Min Nom Max Notes n - x - nD - x - nE - x - A - - x bp x - x D x x x E x x x e - x(∗) - Lp x - x w - - x x - - x y - - x Group includes dimensions that not belong to Group 1, but are associated with the fabrication of packages and dimensions of terminal position areas The group is to achieve its own original purpose as an industry standard The group belongs to the dimensions and numerals of external shapes of packages useful for design and manufacture and the dimensions of terminal position areas that can be referenced to in fabrications of mounting boards Therefore, external dimensions of a package shall have nominal design values specified thereto Ref Min Nom Max Notes b3 - - x eD - x - eE - x - k x - x k1 x - x l1 - - x ( ZD ) - x - ( ZE ) - x - BS EN 60191-6:2009 – 32 – 60191-6 © IEC:2009 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 Explanation of the symbols (∗) means true geometrical position [] values given within square brackets are calculated values y S means in this drawing that the distance from the seating plane to the nearest point of each terminal should not exceed y mm NOTES All dimensions are in millimetres n refers to the total number of terminal positions nD refers to the number of terminal positions on one side of the package in the direction of dimension D nE refers to the number of terminal positions on one side of the package in the direction of dimension E Check of the dimensions and positions of package terminal is validly performed when it is ensured that these terminal fit with the pattern of terminal position areas This can be carried out by means of an appropriate gauge Length of terminal pad number shall be visibly greater than the length of the other terminal pads BS EN 60191-6:2009 60191-6 © IEC:2009 Ball grid array package (BGA) A E B D Terminal A1 index area IEC 2276/09 Figure A.15a – Top view y1 S A1 y cz (A2) A S IEC 2277/09 (ZE) e Figure A.15b – Side view 123 e (ZD) n×∅b X1 M S A M A M X2 M S IEC 2278/09 Figure A.15c – Bottom view Dmax e e ∅b4 ∅b3 Emax e e Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 A.8 – 33 – IEC 2279/09 Figure A.16 – Pattern of terminal position areas Date 2009 BS EN 60191-6:2009 60191-6 © IEC:2009 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 – 34 – Group includes dimensions and numerals associated with the mounting of packages and kinds of packages The dimensions and numerals belonging to the group mean values guaranteed to users and imply that mechanical compatibility of mounting of packages can be recognized Symbol Min Nom Max n - x - Theoretically exact dimension - A - - x - A1 x - x - A2 - (x) - - b x - x - D x x x E x x x e - - - x v - - x - X1 - - x - X2 - - x - y - - x - y1 - - x - Notes Group includes dimensions that not belong to Group 1, but are associated with the fabrication of packages and dimensions of terminal position areas The group is to achieve its own original purpose as an industry standard The group belongs to the dimensions and numerals of external shapes of packages useful for design and manufacture and the dimensions of terminal position areas that can be referenced to in fabrications of mounting boards Therefore, external dimensions of a package shall have nominal design values specified thereto Symbol Min Nom Max Notes b3 - - [x] 1, b4 - - [x] 1, ZD - (x) - ZE - (x) - BS EN 60191-6:2009 60191-6 © IEC:2009 – 35 – Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 Explanation of the symbols (∗) means true geometrical position [] values given within square brackets are calculated values P means projected tolerance zone (see ISO 1101, Clause 13) y cz means in this drawing the distance from the common zone of each terminal NOTES All dimensions are in millimetres n refers to the total number of terminal positions Check of the dimensions and positions of package terminal is validly performed when it is ensured that these terminal fit with the pattern of terminal position areas This can be carried out by means of an appropriate gauge Verification of the dimensions and positions of package terminal is validly performed when it is ensured that these terminal fit with the pattern of terminal position areas This verification may be carried out by means of an appropriate functional gauge b3 and b4 are virtual size obtained from maximum material size of the ball diameter and positional tolerance b3 = b max + x1 b4 = b max + x2 BS EN 60191-6:2009 60191-6 © IEC:2009 Annex B (informative) Optional table format In case the dimension table specifies a large number of package variations, the examples in tables below may be used B.1 Overall dimension table (example) Min Nom Max X V X X X X - V X X V V V V - X X V X X X X X X - V X - V X n A A1 A2 A3 bp c D E e f HE Lp t … Group Ref b1 b3 c1 l1 … Group Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 – 36 – “X” = common dimension “V” = variable dimension Degrees Notes BS EN 60191-6:2009 60191-6 © IEC:2009 Common dimension table (example) Ref Min Nom Max X X X X X - X X - X X X X X X X - X - X Degrees Notes … Group A A1 A2 A3 c f Lp t c1 l1 … Group B.3 Variable dimension table (example) n bp D E e HE Package variation AA Package variation AB Package variation AC Min Nom Max Min Nom Max Min Nom Max V V V - V V V V V V V V - V V V - V V V V V V V V - V V V - V V V V V V V V - - V - V - V - V - V - V …… Group Ref b1 b3 …… Group Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 B.2 – 37 – …….…… …….…… Min Nom Max BS EN 60191-6:2009 – 38 – 60191-6 © IEC:2009 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 Bibliography IEC 60191-2, Mechanical standardization of semiconductor devices – Part 2: Dimensions IEC 60191-3, Mechanical standardization of semiconductor devices – Part 3: General rules for the preparation of outline drawings of integrated circuits ISO 2692: Technical drawings – Geometrical tolerancing – Maximum material principle This page deliberately left blank Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:46, (c) The British Standards Institution 2012 WB9423_BSI_StandardColCov_noK_AW:BSI FRONT COVERS 5/9/08 12:55 Page British Standards Institution (BSI) BSI is the independent national body responsible for preparing British Standards It presents the UK view on standards in Europe and at 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