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... Bibliography 18 9 19 0 19 0 19 2 19 5 19 7 200 2 01 203 206 208 211 213 213 214 214 216 CHAPTER Packaging and Reliability Considerations for MEMS 217 Key Design and Packaging Considerations Wafer or Wafer-Stack ... Bibliography 17 2 17 4 17 4 17 6 18 0 18 2 18 3 18 5 18 5 18 6 18 7 CHAPTER MEM Structures and Systems in RF Applications 18 9 Signal Integrity in RF ME...

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... 2. 3–3 .2 5.5 450 1,035 1. 42 75 — 340 — 27 5 — 2. 5 — 8.4 14 21 >1 .2 16 15.4 0 .23 0.06 0 .22 2. 4 2. 6 0.17 2. 2 0.55 0 .25 3.1 2. 8 0.16 2. 65 0.55 0.14 3 .2 4 .2 0.10 3.5 1.0 5.3 5.9 0.31 3 .26 4.0 0.31 3. 62 ... tracking, and environmental and security surveillance Weapons safing, arming, and fusing Integrated microoptomechanical components for identify-friend-or-fo...

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... Polyvinylidene-fluoride (PVDF) LiNbO3 BaTiO3 PZT zinc oxide (ZnO) Piezoelectric Constant (dijj) −12 (10 C/N) d 33 = 2 .31 d31 = 23 d 33 = 33 d31 =−4, d 33 = 23 d31 = 78, d 33 = 190 d31 = −171 d 33 = 37 0 d31 ... [9] Zorman, C A., and M Mehregany, “Materials for Microelectromechanical Systems,” in The MEMS Handbook, Chapter 15, M Gad-el-Hak (ed.), Boca Raton, FL: CRC Press, 2002 [1...

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... For uniform and void-free bonding, the surfaces must be free of particles and chemical contamination, flat to within about µm across a 100-mm wafer, and smoother than about 0. 5- to 1-nm RMS roughness ... cavities, self-limiting pyramidal and V-shaped pits, and thin membranes; and (b) etching from both sides of the wafer can yield a multitude of different shapes including h...

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... Benecke, and P Lange, “TMAHW Etchants for Silicon Micromachining,” Proc 1991 Int Conf on Solid-State Sensors and Actuators, San Francisco, CA, June 24–27, 1991, pp 8 15 818 [9] Ammar, E S., and T ... Fusion Bonding and Deep Reactive Ion Etching; A New Technology for Microstructures,” Proc 8th Int Conf on Solid-State Sensors and Actuators, Stockholm, Sweden, June 25 29, 19 95, pp 55...

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... bottom handle wafer Silicon-fusion bonding of a p-type top wafer with an n-type epixatial layer encapsulates and seals the cavity Electrochemical etching or standard polishing thins down the top ... Minnesota, and [ 16] .) 96 MEM Structures and Systems in Industrial and Automotive Applications because it can be deposited under low tensile stress, and it retains its structural int...

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... Hz )]; bandwidth (Hz); resolution (º/s); and dynamic range (dB), the latter two being functions of noise and bandwidth Short- and long-term drift of the output, known as bias drift, is another ... and Systems in Industrial and Automotive Applications Electrostatic drive and sense electrodes Vibrating ring Anchor Support flexures Antinode Node Node 45° Antinode Node Antinode Primar...

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... 85 , No 11, November 1997, pp 183 3– 185 6 130 MEM Structures and Systems in Industrial and Automotive Applications [12] Muller, R S., and K Y Lau, “Surface-Micromachined Microoptical Elements and ... “Genetic Analysis Systems: Improvements and Methods,” Tech Digest Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, June 8 11, 19 98, pp 7–10 [43] U.S Patent 6,533...

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... unloaded actuator on the right-hand side is equal to the mass of the loaded actuator (left-hand side) and the mirror Externally applied in-plane accelerations cause equal but opposite torques on ... as the C-Band) and 1,570 nm to 1,610 nm (known as the L-Band) The International Telecommunication Union (ITU) of Geneva, Switzerland, has specified the use to be on a grid of discrete ch...

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... 310 317 [10] Jerman, H., and J D Grade, “A Mechanically-Balanced, DRIE Rotary Actuator for a High-Power Tunable Laser,” Tech Digest Solid-State Sensor and Actuator Workshop, Hilton Head Island, ... products, it remains an enabling technology and a means to an end It is imperative to understand the final application in order to assess the importance and applicability of MEMS...

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