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Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_3 ppt
... impedance matching FIGURE 3.12: Measured and simulated input resistance and reactance of the inkjet-printed RFID tag THREE- DIMENSIONAL PACKAGING IN MULTILAYER ORGANIC SUBSTRATES 23 As a benchmark ... alternate sample so that the measurement of the packaged chip could be made immediately upon removal from the water The gain of the packaged MMIC was then measured and compared wi...
Ngày tải lên: 21/06/2014, 22:20
Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_4 docx
... verifying the advantageous feature of the 3D modules that they can easily integrate additional or reconfigurable capabilities FIGURE 4.13: The comparison between measured and simulated S-parameters ... very mature multilayer fabrication capabilities of LTCC (εr = 7.1, tan ı = 0.0019, metal layer thickness, m; number of layers, six; dielectric layer thickness, 53 m; minimum metal line width...
Ngày tải lên: 21/06/2014, 22:20
Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_5 docx
... filters, and the remaining layers are reserved CAVITY-TYPE INTEGRATED PASSIVES L metal substrate W metal H substrate metal substrate metal substrate metal substrate metal substrates 6-10 (a) microstrip ... 5.5: Comparison between measured and simulated (a) S21 and (b) S11 of three- pole cavity bandpass filter using slot excitation with an open stub bandpass filter In the measurements, t...
Ngày tải lên: 21/06/2014, 22:20
