intermodulation distortion in microwave and wireless circuits
intermodulation distortion in microwave and wireless circuits
... original ones, and the lines that constitute distortion sidebands. In wireless systems, the former are known as Figure 1.9 The effect of bandpass filtering on the inband and out-of-band distortion. ... common use to reserve the name ‘ distortion ’ for nonlinear distortion. Accordingly, in the 1. Strictly speaking, the distinction between inband and out-of-band distortion com...
Ngày tải lên: 24/08/2014, 17:22
introduction to electromagnetic compatibility (wiley series in microwave and optical engineering)
... with and insights gained from working with colleagues in the EMC group at IBM Information Products Division in Lexington, Kentucky (now Lexm ark International) during a sabbatical leave in 1984 and ... for emitting and/ or picking up electromagnetic energy, and are usually quite efficient in doing so. Generally speaking, the longer the cable, the more effi- cient it is in emitt...
Ngày tải lên: 01/06/2014, 10:02
Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_3 ppt
... multilayer lamination in very low temperatures (∼150 ◦ C) and it enevironmentally-friendly (“gree”) characteristics, especially in the UHF and Wireless frequency bands. THREE-DIMENSIONAL PACKAGING IN MULTILAYER ... effective way for impedance matching. FIGURE 3.12: Measured and simulated input resistance and reactance of the inkjet-printed RFID tag. THREE-DIMENSIONAL PACKAGING...
Ngày tải lên: 21/06/2014, 22:20
Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_4 docx
... patch bandpass filter. The feeding lines and the open-circuit resonators have been inserted into the different metallization layers (feeding lines: 2nd and, 4th resonators M2; 1st, 3rd, and 5th ... The coupling spacing [d 12 in Fig. 4.7(a)] between the first and second resonators for the required k 12 was determined from Fig. 4.9(b). k 23 and d 23 are determined in the same way as...
Ngày tải lên: 21/06/2014, 22:20
Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_5 docx
... microstrip lines into the cavity. For a preliminary testing of the vertical intercoupling of three-pole cavity bandpass filter, the input and output feedlines are placed on metals 1 and 4, respectively; ... ter determining the initial dimensions of the external/internal slots, the other design parameters such the cavity length and width [L and W in F ig. 5.2(a)] using via walls are d...
Ngày tải lên: 21/06/2014, 22:20
Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_7 ppt
... coupling, M 12, is realized through the electrical coupling and is controlled by the offsets of the I/O feeding structures. Also, the intercouplings, M 13 and M 32, are determined by the size and ... the intercoupling slots and dominated by the magnetic coupling. It is worth noting that M 13 is different from M 32 since the magnitude of the magnetic dipole moment of each mode in a c...
Ngày tải lên: 21/06/2014, 22:20
Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_8 ppt
... factor contributing to the radiation pattern improvement is the fringing field along the inner edge of the soft surface ring. This fringing field along with the fringing field at the radiating edges of ... whose phase and amplitude contain the information transmitted through short-range indoor wireless personal area network (WPAN) and as a reflector to improve the gain. 6.2.2 Simulation an...
Ngày tải lên: 21/06/2014, 22:20
Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_10 pot
... Noll ,and D.R. Singh, “RF characterization of a low-cost multichip packaging technology for monolithic microwave and millimeter wave integrated circuits, ” in URSI Int. Signals, Systems, and Electronics ... Tentzeris, “Design and characterization of novel paper-based inkjet-printed RFID and microwave structures for telecommunication and sensing applications,” in 2007 IEEE...
Ngày tải lên: 21/06/2014, 22:20
achieving collision avoidance and fairness in csma based wireless mesh networks ppt
Ngày tải lên: 19/03/2014, 00:20
esd design challenges and strategies in deeply scaled integrated circuits ppt
Ngày tải lên: 01/04/2014, 11:21