Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim Part 4 pdf
microsensors mems and smart devices gardner varadhan and awadelkarim pot
... FETs
93
4. 3.5
SOI
CMOS Processing
97
4. 4
Monolithic Mounting
99
4. 4.1
Die
Bonding
and
Wire
Bonding
100
4. 4.2 Tape-Automated Bonding
101
4. 4.3 Flip
TAB
Bonding
103
4. 4 .4 Flip-Chip ... (um)
0. 1-1 0
0. 3-1 00
0. 1-0 .5
0. 1-0 .3
Bake temperature (°C)
9 0-1 50
35 0 -4 50
50 0-9 00
650
Solvent
Weak
base
Weak
base
HF
HNO
3
Table
2 .4
Commercially ava...
Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim Part 1 pdf
... Device
40 1
14. 3.2 Integration
of the SAW
Device
and
Seismic Mass
40 2
14. 4 Testing
of a
MEMS- IDT Accelerometer
40 2
14. 4.1 Measurement Setup
40 3
14. 4.2 Calibration Procedure
40 4
14. 4.3
... 40 5
14. 4 .4 Experimental
40 6
14. 4.5
Fabrication
of
Seismic
Mass
40 8
14. 5 Wireless Readout
41 2
14. 6 Hybrid Accelerometers
and
Gyroscopes
41 4
14...
Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim Part 2 ppt
... 10
-5
168
11.7
190
6.9
GaAs
5316
1510
10
-1 1
47
12
-
—
SiO
2
1 544
1880
-
6. 5-1 1
4. 3 -4 .5
380
14
Si
3
N
4
344 0
1900
-
19
7.5
380
14
Al
2699
660
377
236
-
70
50
Au
19320
10 64
488
319
-
78
200
Ti
45 08
1660
26
22
-
-4 0
48 0
"Measured
... (um)
0. 1-1 0
0. 3-1 00
0. 1-0 .5
0. 1-0 .3
Bake temperature (°C)
9 0-1 50
35 0 -4 50
5...
Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim Part 3 pdf
... orientation
0.5 0-0 .55
3 0-3 5
1 6-2 0
0.6 0-0 .65
4 0 -4 5
2 5-3 0
70
65
0.6 5-0 .70
5 5-6 0
3 5 -4 0
60
50
(100)
or
(111)
(100)
or
(111)
(100)
or
(111)
"Wafer
flats are
defined
in
Section
4. 2.
from
... structure
Zinc-blende
structure
Zinc-blende
structure
Zinc-blende
structure
Zinc-blende
structure
Zinc-blende
structure
Zinc-blende
structure
Zin...
Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim Part 4 pdf
... test
Reworkability
Die
attach
and
wire
bond
1
30 0-5 00
2 0-1 00
2. 0-3 .5
4- 7
Excellent
DC
Poor
TAB
>2
50 0-7 00
3 -4
4. 0-5 .0
3 -4
Fair
AC
Poor/Fair
Flip
TAB
>2
50 0-7 00
3 -4
4. 0-5 .0
3 -4
Fair
AC
Fair
Flip
Chip
0.8
1000
10
<1.0
10
Poor
AC
Poor
basic
... n-p-n
transistor:
(a)
common-emitter;
(b)
common-base;
and (c)
common-collector
MO...
Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim Part 5 pdf
... conductivity
Units
%
-
1 0-
6
/°C
g/cm
3
-
10
–3
kV/mm
GPa
ft-cm
J/g.°K
W/m.°K
AI
2
O
3
99.5
White
7.6
3.87
9.9
0.1
24
400
10
14
-
2 0-3 5
AI
2
O
3
96
White
7.1
3.7
9.5
0 .4
26
250
10
14
-
2 0-3 5
BeO
99.5
White
9.0
3.01
6.5
0 .4
9.5
17 0-2 40
10
15
-
25 0-2 60
A1N
9 8-9 9.8
Dark
grey
4. 4
3.255
8. 8-8 .9
0. 7-2 .0
1 0-1 4
28 0-3 20
>1...
Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim Part 9 ppt
... types
of
MEMS
RADIATION
SENSORS
241
Radition
sensors
Number
particles
X
ray
X
ray
-
Plastic
film
-
Thermoluminescent
-
Solid-state
-Photoconductive
-Photovoltaic
-Photoconductive
-
Photovoltaic
"
... process
and
three
ways
in a
CMOS process
to
make
a p-n
diode (see Table 4. 2).
The I-V
characteristic
of
a p-n
diode
is
nonlinear (Figure 4. 19)...
Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim Part 10 docx
... density
(mg/Hz)
Package"
Price(€)*
Motorola
XMMAS4
01G1D
1
40 g
20 g
-4 0 to 105
5
40 0
0.5
N/A
7.8
16-pin
DIP,
SIP
11
Bosch
SMB050
1
±35 g
-
-
7
40 0
0.5
N/A
-
28-pin
PLCC
N/A
Bosch
SMB060
2
±35 g
-
-
12
40 0
0.5
1
-
28-pin
PLCC
N/A
Analog
devices
ADXL50JH
1
±50 ... control
9
9
9
9
n/a
7
9
30
100
3.3
97
45 5
14
19
0-1 05
5 0-1 05
0-1 05
0-1 05...
Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim Part 11 pps
... SnO
2
Undoped
oxide
Undoped
oxide
Measurand
Methane
Hydrogen
sulfide
Air
quality
(smoke)
Toxic
gas -
CO
Hydrocarbons
Chlorine
Ozone
Range
(PPM)
50 0-1 0000
5-1 00
<10
1 0-1 000
1 0-1 000
0-5
0-0 .3
(Power
mW)
835
660
660
120
40 0
650
800
Cost
a
(euro)
13
50
13
13
15
25
25
a
Price
... based
thick-
film
gas
sensors," Sensors
and
Actuators
B, 43 ,
45 –51...
Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim Part 12 pps
... the
expression
for the
strain-displacement
tensor
is
rewritten
as
du
t
(x,t)
2
j(x,t )-]
4
-
dxt
J
t
, , ,
Sij(x,
0
=
-
—
-
h
-4 -
(10.5)
10 .4. 2 Stress
When
a
body vibrates ... pp.
52 1-5 23.
Grate,
J. W.,
Martin,
S. J. and
White,
R. M.
(1993a). "Acoustic wave microsensors, Part
I,"
Analyt-
ical
Chem.,
65,
94 0-9 48 .
Gra...