Microengineering MEMs and Interfacing - Danny Banks Part 16 pptx
Microengineering MEMs and Interfacing - Danny Banks Part 16 pptx
... pairs, will be considered in this section, the npn and pnp bipolar junction transistor (BJT) and the n- and p-channel enhancement-mode metal-oxide-semiconductor field effect transistor (MOSFET). ... January 16, 2006 12:45 PM Copyright © 2006 Taylor & Francis Group, LLC 284 Microengineering, MEMS, and Interfacing: A Practical Guide the signal is high is referred to as the...
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Microengineering MEMs and Interfacing - Danny Banks Part 3 pptx
... normally produced by direct-write e-beam systems. Masks are normally chrome on quartz or low-expansion glass. 4. X-ray lithography can achieve high resolution and high-aspect-ratio structures, but ... Netherlands. 9. Lide, D.R. Ed., CRC Handbook of Chemistry and Physics, 85th ed., CRC Press, Boca Raton, FL, 2004. 10. Hubbell, J.H. and Seltzer, S.M., Tables of x-ray mass attenuation coef...
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Microengineering MEMs and Interfacing - Danny Banks Part 1 pps
... States of America on acid-free paper 10987654321 International Standard Book Number-10: 0-8 24 7-2 30 5-8 (Hardcover) International Standard Book Number-13: 97 8-0 -8 24 7-2 30 5-7 (Hardcover) This book ... LLC DK3182_title 1/19/06 8:35 AM Page 1 Microengineering, MEMS, and Interfacing A Practical Guide Danny Banks Monisys Ltd. Birmingham, England A CRC title, part...
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Microengineering MEMs and Interfacing - Danny Banks Part 2 potx
... exposure systems are discussed) into a three-dimensional or two- and- a-half-dimensional pattern in a structural material. The description “two -and- a-half-dimensional” is used because, as you will ... Rate and Resolution Effects 291 12.3.4 Other ADC Errors 292 12.3.4.1 Missing Codes 292 12.3.4.2 Full-Scale Error 292 12.3.5 Companding 292 12.4 Analog-to-Digital Converters 292 12.4.1 Samp...
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Microengineering MEMs and Interfacing - Danny Banks Part 4 pot
... enpotic materials. At the time of writing, 12-in. wafers are only available in the most advanced IC fabs, and most MEMS work is performed on 4- and 6-in. wafers. Wafer suppliers will normally supply ... Group, LLC 44 Microengineering, MEMS, and Interfacing: A Practical Guide which provides a device-quality surface for circuit fabrication. Silicon dioxide, silicon nitride,...
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Microengineering MEMs and Interfacing - Danny Banks Part 5 pot
... for use in MEMS (and elec- tronic) devices, porous silicon has a vast surface-to-volume ratio, and conse- quently it is etched much more rapidly than normal silicon. By selectively anod- izing different ... structure to shape and polish it. DK3182_C003.fm Page 73 Monday, January 16, 2006 12:44 PM Copyright © 2006 Taylor & Francis Group, LLC 68 Microengineering, MEMS, and In...
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Microengineering MEMs and Interfacing - Danny Banks Part 6 pdf
... related to self-assembled mono- layers; long-chain molecules that spontaneously self-organize when printed onto the appropriate substrate — in particular, alkanethiols on silver and gold sub- strates ... photoresist and then SU-8, (b) the SU-8 and resist are patterned, (c) electroplating is used to form a nickel structure, (d) the photoresist layer is then stripped off, taking the SU-8...
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Microengineering MEMs and Interfacing - Danny Banks Part 7 ppt
... & Francis Group, LLC 116 Microengineering, MEMS, and Interfacing: A Practical Guide FIGURE 4 .16 (a) “wafer,” (b) “wafer” zoomed in to the left-hand edge and expanded. The black circular border ... m and 16 µ m on a side (large and small, respectively). This may imply a ± 2- µ m alignment error, but it will be influenced by various factors, such as over- o...
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Microengineering MEMs and Interfacing - Danny Banks Part 8 pot
... on low-expansion glass or quartz. Mask plates should, clearly, be larger than the wafer being processed: a 2-in. (50-mm)-diameter wafer would require 2.5-in. (63.5-mm) square blank, and a 4-in. ... 129 Monday, January 16, 2006 12:47 PM Copyright © 2006 Taylor & Francis Group, LLC 138 Microengineering, MEMS, and Interfacing: A Practical Guide 5.5 CHEMICAL SENSORS AND BIOSENS...
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Microengineering MEMs and Interfacing - Danny Banks Part 9 pot
... most common and well-developed method, but it does suffer a little from wear and sticking problems. Magnetic actuators usually require rela- tively high currents (and high power) and, on the ... Friday, January 13, 2006 10:59 AM Copyright © 2006 Taylor & Francis Group, LLC 160 Microengineering, MEMS, and Interfacing: A Practical Guide Notice that in Equation 7.4, a hydrog...
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