Microengineering MEMs and Interfacing - Danny Banks Part 14 docx
Microengineering MEMs and Interfacing - Danny Banks Part 14 docx
... rate and
gain–bandwidth product.
Consider a circuit with a closed-loop gain of 100, supplied by ±12-V power
rails. The op-amp chosen has a gain–bandwidth product (also known as f
t
) of
10 MHz and ... the op-amp’s ability to track a fast-moving input signal.
Gain–Bandwidth Product and Slew Rate
• The gain–bandwidth product (in Hz) gives the frequency at which
the open-loop gain of the o...
Microengineering MEMs and Interfacing - Danny Banks Part 13 docx
...
Microengineering, MEMS, and Interfacing: A Practical Guide
“Computer Interfacing, ” but focuses mainly on analog-to-digital and digital-to-
analog conversion. Many of the approaches employed in digital interfacing ... This was divided into showered-
ion-beam milling (SIBM) and focused-ion-beam milling (FIBM). The former thins
out samples
simultaneously over a large area,...
Microengineering MEMs and Interfacing - Danny Banks Part 15 docx
... that may be of
use, the band-pass filter and band-stop filter. These can be created by cascading
RC low-pass and high-pass filters with buffer amplifiers (see Figure 11.25a and
Figure 11.25c). Their ... band.
For a low-pass filter, the phase shift will be 0° in the pass band, increasing to
45° at the 3-dB point and to 90° in the stop band. For a high-pass filter, it will
be +90° in the stop...
Microengineering MEMs and Interfacing - Danny Banks Part 1 pps
... States of America on acid-free paper
10987654321
International Standard Book Number-10: 0-8 24 7-2 30 5-8 (Hardcover)
International Standard Book Number-13: 97 8-0 -8 24 7-2 30 5-7 (Hardcover)
This book ... LLC
DK3182_title 1/19/06 8:35 AM Page 1
Microengineering, MEMS,
and Interfacing
A Practical Guide
Danny Banks
Monisys Ltd.
Birmingham, England
A CRC title, part...
Microengineering MEMs and Interfacing - Danny Banks Part 2 potx
... exposure systems are discussed) into a three-dimensional or two-
and- a-half-dimensional pattern in a structural material. The description “two -and-
a-half-dimensional” is used because, as you will ... Rate
and Resolution Effects 291
12.3.4 Other ADC Errors 292
12.3.4.1 Missing Codes 292
12.3.4.2 Full-Scale Error 292
12.3.5 Companding 292
12.4 Analog-to-Digital Converters 292
12.4.1 Samp...
Microengineering MEMs and Interfacing - Danny Banks Part 3 pptx
... normally produced by direct-write e-beam systems. Masks
are normally chrome on quartz or low-expansion glass.
4. X-ray lithography can achieve high resolution and high-aspect-ratio
structures, but ... Netherlands.
9. Lide, D.R. Ed., CRC Handbook of Chemistry and Physics, 85th ed., CRC Press,
Boca Raton, FL, 2004.
10. Hubbell, J.H. and Seltzer, S.M., Tables of x-ray mass attenuation coef...
Microengineering MEMs and Interfacing - Danny Banks Part 4 pot
... enpotic materials. At the time
of writing, 12-in. wafers are only available in the most advanced IC fabs, and
most MEMS work is performed on 4- and 6-in. wafers.
Wafer suppliers will normally supply ... Group, LLC
44
Microengineering, MEMS, and Interfacing: A Practical Guide
which provides a device-quality surface for circuit fabrication. Silicon dioxide,
silicon nitride,...
Microengineering MEMs and Interfacing - Danny Banks Part 5 pot
... for use in MEMS (and elec-
tronic) devices, porous silicon has a vast surface-to-volume ratio, and conse-
quently it is etched much more rapidly than normal silicon. By selectively anod-
izing different ... Microengineering, MEMS, and Interfacing: A Practical Guide
The silicon diaphragm is the basic structure used to construct pressure sensors
and some accelerometers. Silicon diap...
Microengineering MEMs and Interfacing - Danny Banks Part 6 pdf
... related to self-assembled mono-
layers; long-chain molecules that spontaneously self-organize when printed onto
the appropriate substrate — in particular, alkanethiols on silver and gold sub-
strates ...
80
Microengineering, MEMS, and Interfacing: A Practical Guide
widespread form is photolithographic processing in the form of photoresists, poly-
imides, and photoformable epoxies...
Microengineering MEMs and Interfacing - Danny Banks Part 7 ppt
... LLC
116 Microengineering, MEMS, and Interfacing: A Practical Guide
FIGURE 4.16 (a) “wafer,” (b) “wafer” zoomed in to the left-hand edge and expanded.
The black circular border is on a separate non-fabrication ... fabrication. In this case,
a 4-in. (100-mm)-diameter wafer will be used. The structure wafer is created
and, to simplify the layout, an annulus (ring) of 100-mm outside diame...
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