Microengineering MEMs and Interfacing - Danny Banks Part 14 docx

... rate and gain–bandwidth product. Consider a circuit with a closed-loop gain of 100, supplied by ±12-V power rails. The op-amp chosen has a gain–bandwidth product (also known as f t ) of 10 MHz and ... the op-amp’s ability to track a fast-moving input signal. Gain–Bandwidth Product and Slew Rate • The gain–bandwidth product (in Hz) gives the frequency at which the open-loop gain of the o...

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... Microengineering, MEMS, and Interfacing: A Practical Guide “Computer Interfacing, ” but focuses mainly on analog-to-digital and digital-to- analog conversion. Many of the approaches employed in digital interfacing ... This was divided into showered- ion-beam milling (SIBM) and focused-ion-beam milling (FIBM). The former thins out samples simultaneously over a large area,...

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... that may be of use, the band-pass filter and band-stop filter. These can be created by cascading RC low-pass and high-pass filters with buffer amplifiers (see Figure 11.25a and Figure 11.25c). Their ... band. For a low-pass filter, the phase shift will be 0° in the pass band, increasing to 45° at the 3-dB point and to 90° in the stop band. For a high-pass filter, it will be +90° in the stop...

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... States of America on acid-free paper 10987654321 International Standard Book Number-10: 0-8 24 7-2 30 5-8 (Hardcover) International Standard Book Number-13: 97 8-0 -8 24 7-2 30 5-7 (Hardcover) This book ... LLC DK3182_title 1/19/06 8:35 AM Page 1 Microengineering, MEMS, and Interfacing A Practical Guide Danny Banks Monisys Ltd. Birmingham, England A CRC title, part...

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... exposure systems are discussed) into a three-dimensional or two- and- a-half-dimensional pattern in a structural material. The description “two -and- a-half-dimensional” is used because, as you will ... Rate and Resolution Effects 291 12.3.4 Other ADC Errors 292 12.3.4.1 Missing Codes 292 12.3.4.2 Full-Scale Error 292 12.3.5 Companding 292 12.4 Analog-to-Digital Converters 292 12.4.1 Samp...

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... normally produced by direct-write e-beam systems. Masks are normally chrome on quartz or low-expansion glass. 4. X-ray lithography can achieve high resolution and high-aspect-ratio structures, but ... Netherlands. 9. Lide, D.R. Ed., CRC Handbook of Chemistry and Physics, 85th ed., CRC Press, Boca Raton, FL, 2004. 10. Hubbell, J.H. and Seltzer, S.M., Tables of x-ray mass attenuation coef...

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... enpotic materials. At the time of writing, 12-in. wafers are only available in the most advanced IC fabs, and most MEMS work is performed on 4- and 6-in. wafers. Wafer suppliers will normally supply ... Group, LLC 44 Microengineering, MEMS, and Interfacing: A Practical Guide which provides a device-quality surface for circuit fabrication. Silicon dioxide, silicon nitride,...

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... for use in MEMS (and elec- tronic) devices, porous silicon has a vast surface-to-volume ratio, and conse- quently it is etched much more rapidly than normal silicon. By selectively anod- izing different ... Microengineering, MEMS, and Interfacing: A Practical Guide The silicon diaphragm is the basic structure used to construct pressure sensors and some accelerometers. Silicon diap...

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... related to self-assembled mono- layers; long-chain molecules that spontaneously self-organize when printed onto the appropriate substrate — in particular, alkanethiols on silver and gold sub- strates ... 80 Microengineering, MEMS, and Interfacing: A Practical Guide widespread form is photolithographic processing in the form of photoresists, poly- imides, and photoformable epoxies...

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... LLC 116 Microengineering, MEMS, and Interfacing: A Practical Guide FIGURE 4.16 (a) “wafer,” (b) “wafer” zoomed in to the left-hand edge and expanded. The black circular border is on a separate non-fabrication ... fabrication. In this case, a 4-in. (100-mm)-diameter wafer will be used. The structure wafer is created and, to simplify the layout, an annulus (ring) of 100-mm outside diame...

Ngày tải lên: 10/08/2014, 05:20