Microengineering MEMs and Interfacing - Danny Banks Part 13 docx

Microengineering MEMs and Interfacing - Danny Banks Part 13 docx

Microengineering MEMs and Interfacing - Danny Banks Part 13 docx

... Microengineering, MEMS, and Interfacing: A Practical Guide “Computer Interfacing, ” but focuses mainly on analog-to-digital and digital-to- analog conversion. Many of the approaches employed in digital interfacing ... surface and attach it to the probe tip, and reversing DK3182_C010.fm Page 233 Friday, January 13, 2006 11:01 AM Copyright © 2006 Taylor & Francis Group, LLC...

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Microengineering MEMs and Interfacing - Danny Banks Part 14 docx

Microengineering MEMs and Interfacing - Danny Banks Part 14 docx

... January 13, 2006 11:01 AM Copyright © 2006 Taylor & Francis Group, LLC 244 Microengineering, MEMS, and Interfacing: A Practical Guide controlled voltage and current sources (Figure 11.1j and ... the op-amp’s ability to track a fast-moving input signal. Gain–Bandwidth Product and Slew Rate • The gain–bandwidth product (in Hz) gives the frequency at which the open-loop gain...

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Microengineering MEMs and Interfacing - Danny Banks Part 15 docx

Microengineering MEMs and Interfacing - Danny Banks Part 15 docx

... that may be of use, the band-pass filter and band-stop filter. These can be created by cascading RC low-pass and high-pass filters with buffer amplifiers (see Figure 11.25a and Figure 11.25c). Their ... band. For a low-pass filter, the phase shift will be 0° in the pass band, increasing to 45° at the 3-dB point and to 90° in the stop band. For a high-pass filter, it will be +90° in the stop...

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Microengineering MEMs and Interfacing - Danny Banks Part 1 pps

Microengineering MEMs and Interfacing - Danny Banks Part 1 pps

... States of America on acid-free paper 10987654321 International Standard Book Number-10: 0-8 24 7-2 30 5-8 (Hardcover) International Standard Book Number -1 3: 97 8-0 -8 24 7-2 30 5-7 (Hardcover) This book ... Phototransistors 135 5.3.3 Charge-Coupled Devices 135 5.3.4 Pyroelectric Sensors 136 5.4 Magnetic Sensors 137 5.5 Chemical Sensors and Biosensors 138 5.5.1 ISF...

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Microengineering MEMs and Interfacing - Danny Banks Part 2 potx

Microengineering MEMs and Interfacing - Danny Banks Part 2 potx

... exposure systems are discussed) into a three-dimensional or two- and- a-half-dimensional pattern in a structural material. The description “two -and- a-half-dimensional” is used because, as you will ... LLC 13. 2.1.1 Four-Electrode Configuration 298 13. 2.2 Op-Amp Voltage Control 299 13. 3 Transistors 300 13. 3.1 The BJT 300 13. 3.2 The MOSFET 303 13. 4 Relays 306 13. 4.1 Relay Chara...

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Microengineering MEMs and Interfacing - Danny Banks Part 3 pptx

Microengineering MEMs and Interfacing - Danny Banks Part 3 pptx

... normally produced by direct-write e-beam systems. Masks are normally chrome on quartz or low-expansion glass. 4. X-ray lithography can achieve high resolution and high-aspect-ratio structures, but ... Netherlands. 9. Lide, D.R. Ed., CRC Handbook of Chemistry and Physics, 85th ed., CRC Press, Boca Raton, FL, 2004. 10. Hubbell, J.H. and Seltzer, S.M., Tables of x-ray mass attenuation coef...

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Microengineering MEMs and Interfacing - Danny Banks Part 4 pot

Microengineering MEMs and Interfacing - Danny Banks Part 4 pot

... enpotic materials. At the time of writing, 12-in. wafers are only available in the most advanced IC fabs, and most MEMS work is performed on 4- and 6-in. wafers. Wafer suppliers will normally supply ... Friday, January 13, 2006 10:58 AM Copyright © 2006 Taylor & Francis Group, LLC 44 Microengineering, MEMS, and Interfacing: A Practical Guide which provides a device-qua...

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Microengineering MEMs and Interfacing - Danny Banks Part 5 pot

Microengineering MEMs and Interfacing - Danny Banks Part 5 pot

... for use in MEMS (and elec- tronic) devices, porous silicon has a vast surface-to-volume ratio, and conse- quently it is etched much more rapidly than normal silicon. By selectively anod- izing different ... January 13, 2006 10:58 AM Copyright © 2006 Taylor & Francis Group, LLC 60 Microengineering, MEMS, and Interfacing: A Practical Guide FIGURE 2.12 KOH-etched pit and groove....

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Microengineering MEMs and Interfacing - Danny Banks Part 6 pdf

Microengineering MEMs and Interfacing - Danny Banks Part 6 pdf

... related to self-assembled mono- layers; long-chain molecules that spontaneously self-organize when printed onto the appropriate substrate — in particular, alkanethiols on silver and gold sub- strates ... 80 Microengineering, MEMS, and Interfacing: A Practical Guide widespread form is photolithographic processing in the form of photoresists, poly- imides, and photoformable epoxies...

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Microengineering MEMs and Interfacing - Danny Banks Part 7 ppt

Microengineering MEMs and Interfacing - Danny Banks Part 7 ppt

... 13, 2006 10:59 AM Copyright © 2006 Taylor & Francis Group, LLC 116 Microengineering, MEMS, and Interfacing: A Practical Guide FIGURE 4.16 (a) “wafer,” (b) “wafer” zoomed in to the left-hand ... fabrication. In this case, a 4-in. (100-mm)-diameter wafer will be used. The structure wafer is created and, to simplify the layout, an annulus (ring) of 100-mm outside diameter and 90-mm...

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