An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 14 docx
... for optoelectronic and passive fiber-optical components (see Table 8.8) explicitly reference the MIL-STD-202 and 883 standards. Procedures and methods also accompany the MIL standards to guide ... rates and mean time to failures) of electronic equipment [26]. An industry of professional consultants and advisors specializing in quality and reliability standards has come to...
Ngày tải lên: 10/08/2014, 01:22
... student alike to an understanding of how MEMS are designed and fabricated. Dr. Maluf s book concentrates mostly on how to design and manufacture MEMS. This is to be expected of Dr. Maluf, who has ... of Morrison and Foerster. Evan Green and Carter Hand of New Focus were kind enough to review portions of the manuscript. Thanks go to our editor, Mark Walsh, for his unwa...
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... components for identify-friend-or-foe systems Head- and night-display systems Low-power, high-density mass data storage devices Embedded sensors and actuators for condition-based maintenance Integrated ... general support and for recognizing the value of an introductory book on MEMS. I would like to thank Greg Kovacs, Kirt Williams, and Denise Salles for reading the manuscript...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 3 pps
... meaning lithography, elec - troplating, and molding. both PSG and BPSG soften and flow to conform with the underlying surface topog - raphy and to improve step coverage. LTO films are used for passivation ... Zorman, C. A., and M. Mehregany, “Materials for Microelectromechanical Systems,” in The MEMS Handbook, Chapter 15, M. Gad-el-Hak (ed.), Boca Raton, FL: CRC Press,...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 4 pptx
... the anisotropic etching of cavities in {100}-oriented silicon: (a) cavities, self-limiting pyramidal and V-shaped pits, and thin membranes; and (b) etching from both sides of the wafer can yield ... Wet etchants in aqueous solution offer the advantage of low-cost batch fabrication—25 to 50 100-mm-diameter wafers can be etched simultaneously and can be either of the isotropic or aniso...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 5 doc
... Benecke, and P. Lange, “TMAHW Etchants for Silicon Micromachining,” Proc. 1991 Int. Conf. on Solid-State Sensors and Actuators, San Fran- cisco, CA, June 24–27, 1991, pp. 815–818. [9] Ammar, E. S., and ... regularly produced. The cured material is resis - tant to most chemicals and is thermally stable. SU-8 has been used to form microflu - idic channels and optical waveg...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 6 pptx
... Structures and Systems in Industrial and Automotive Applications Bondpad Metal conductors P-type diffused piezoresistor Etched cavity N-type epitaxial layer P-type substrate and frame Anodically bonded Pyrex ... orientation-dependent etching of grooves, wafer bonding, and dicing [8], and (b) nozzle formed by DRIE and wafer bonding. (After: [9].) Mandrel Photoresist 1. Make mandrel...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 7 pot
... )]°⋅sHz ; bandwidth (Hz); resolution (º/s); and dynamic range (dB), the lat- ter two being functions of noise and bandwidth. Short- and long-term drift of the output, known as bias drift, is another ... dioxide insulator TaAl resistor Al conductor 1. Grow oxide for insulator, sputter TaAl and Al, pattern Al and TaAl, pattern Al again to form resistor and conductive trace. 2. PEC...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 8 ppt
... fashion similar to the electronic transistor. development activities appears to be. An application for micropumps is likely to be in the automated handling of fluids for chemical analysis and drug delivery systems. Stand-alone ... Netherlands, January 29–February 2, 1995, pp. 19–24. Selected Bibliography Frank, R., Understanding Smart Sensors, Norwood, MA: Artech House, 1996. Gad-El...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 9 pps
... unloaded actuator on the right-hand side is equal to the mass of the loaded actuator (left-hand side) and the mirror. Externally applied in-plane accelerations cause equal but opposite torques on ... (known as the L-Band). The International Telecommunication Union (ITU) of Geneva, Switzerland, has specified the use to be on a grid of discrete channels throughout the C- and L-Bands at...
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