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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 14 docx

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 14 docx

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 14 docx

... for optoelectronic and passivefiber-optical components (see Table 8.8) explicitly reference the MIL-STD-202 and 883 standards. Procedures and methods also accompany the MIL standards to guide ... rates and mean time to failures) of electronic equipment [26]. An industry of professional consultants and advisors specializing in quality and reliability standards has come to exist. The manufacturer ... performing the tests and interpreting the data. For example, theMIL-HDBK-H-108 provides sampling procedures and tables for reliability and lifetesting, and the MIL-HDBK-217 discusses reliability...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 1 doc

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 1 doc

... student alike to an understanding of how MEMS aredesigned and fabricated. Dr. Maluf s book concentrates mostly on how to design and manufacture MEMS. This is to be expected of Dr. Maluf, who has ... ofMorrison and Foerster. Evan Green and Carter Hand of New Focus were kindenough to review portions of the manuscript. Thanks go to our editor, Mark Walsh,for his unwavering support. Kirt Williams ... Capacitors 192Bulk-Micromachined Variable Capacitors 195Micromachined Inductors 197Microelectromechanical Resonators 200Comb-Drive Resonators 201Beam Resonators 203Coupled-Resonator Bandpass...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 2 pptx

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 2 pptx

... components for identify-friend-or-foesystemsHead- and night-display systemsLow-power, high-density mass data storage devicesEmbedded sensors and actuators for condition-based maintenanceIntegrated ... general support and for recognizing the value of an introductory bookon MEMS. I would like to thank Greg Kovacs, Kirt Williams, and Denise Salles forreading the manuscript and providing valuable ... products. Ongoing efforts at many companies and laboratoriesthroughout the world promise to deliver, in the not-too-distant future, new and sophisticated miniature components and microsystems. It is...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 3 pps

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 3 pps

... meaning lithography, elec - troplating, and molding.both PSG and BPSG soften and flow to conform with the underlying surface topog - raphy and to improve step coverage. LTO films are used for passivation ... Zorman, C. A., and M. Mehregany, “Materials for Microelectromechanical Systems,” inThe MEMS Handbook, Chapter 15, M. Gad-el-Hak (ed.), Boca Raton, FL: CRC Press,2002.[10] Zhang, Z. L., and ... quickly extended to a broad range of other alloys, including titanium-nickel, copper-aluminum-nickel,iron-nickel and iron-platinum alloys. A basic understanding of the underlying physi - cal principles...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 4 pptx

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 4 pptx

... the anisotropic etching of cavities in {100}-oriented silicon: (a) cavities,self-limiting pyramidal and V-shaped pits, and thin membranes; and (b) etching from both sides ofthe wafer can yield ... Wet etchants in aqueous solution offer the advantage of low-cost batchfabrication—25 to 50 100-mm-diameter wafers can be etched simultaneously and can be either of the isotropic or anisotropic ... uniform and controlled etch depths. Some applications, such asbulk-micromachined pressure sensors, demand a thin ( 5- to 2 0- m) silicon mem - brane with dimensional thickness control and uniformity...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 5 doc

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 5 doc

... Benecke, and P. Lange, “TMAHW Etchants for SiliconMicromachining,” Proc. 1991 Int. Conf. on Solid-State Sensors and Actuators, San Fran-cisco, CA, June 24–27, 1991, pp. 815–818.[9] Ammar, E. S., and ... regularly produced. The cured material is resis - tant to most chemicals and is thermally stable. SU-8 has been used to form microflu - idic channels and optical waveguides. It has also been used ... BibliographyChang, C. Y., and S. M. Sze (eds.), ULSI Technology, New York: McGraw-Hill, 1996.Flamm, D. L., and G. K. Herb, “Plasma Etching Technology,” in Plasma Etching: An Introduction, D. M. Manos and...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 6 pptx

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 6 pptx

... Structures and Systems in Industrial and Automotive ApplicationsBondpadMetal conductorsP-type diffusedpiezoresistorEtched cavityN-typeepitaxiallayerP-typesubstrate and frameAnodicallybondedPyrex ... orientation-dependentetching of grooves, wafer bonding, and dicing [8], and (b) nozzle formed by DRIE and waferbonding. (After: [9].)MandrelPhotoresist1. Make mandrel, pattern photoresistMetal2. ... 9.81 m/s2), sensitivity (V/G), reso - lution (G), bandwidth (Hz), cross-axis sensitivity, and immunity to shock. Therange and bandwidth required vary significantly depending on the application.Accelerometers...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 7 pot

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 7 pot

... )]°⋅sHz; bandwidth (Hz); resolution (º/s); and dynamic range (dB), the lat-ter two being functions of noise and bandwidth. Short- and long-term drift of theoutput, known as bias drift, is another ... dioxideinsulatorTaAl resistorAl conductor1. Grow oxide for insulator, sputter TaAl and Al, pattern Al and TaAl,pattern Al again to form resistor and conductive trace.2. PECVD silicon nitride and ... TaAl is resistive and has a near-zero thermal coeffi-cient of expansion [38], while Al is a good conductor. The aluminum and TaAl arepatterned, leaving an Al/TaAl sandwich to form conductive...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 8 ppt

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 8 ppt

... fashion similar to the electronic transistor.development activities appears to be. An application for micropumps is likely to be in the automated handling of fluids for chemical analysis and drug deliverysystems.Stand-alone ... Netherlands, January 29–February 2, 1995,pp. 19–24.Selected BibliographyFrank, R., Understanding Smart Sensors, Norwood, MA: Artech House, 1996.Gad-El-Hak, M., The MEMS Handbook, Boca Raton, ... Digest Solid-State Sen - sor and Actuator Workshop, Hilton Head Island, SC, June 3–6, 1996, pp. 200–204.[39] Allen, R. R., J. D. Meyer, and W. R. Knight, “Thermodynamics and Hydrodynamics ofThermal...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 9 pps

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 9 pps

... unloaded actuator on the right-hand side is equal to themass of the loaded actuator (left-hand side) and the mirror. Externally appliedin-plane accelerations cause equal but opposite torques on ... (known as the L-Band).The International Telecommunication Union (ITU) of Geneva, Switzerland, hasspecified the use to be on a grid of discrete channels throughout the C- and L-Bandsat optical ... processing and routing of data and voice. The use of tunable lasers intelecommunications has been primarily in the wavelength range of 1,528 nm to 1,565 nm (known as the C-Band) and 1,570 nm to 1,610...
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