An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 5 doc

... Benecke, and P. Lange, “TMAHW Etchants for Silicon Micromachining,” Proc. 1991 Int. Conf. on Solid-State Sensors and Actuators, San Fran- cisco, CA, June 24–27, 1991, pp. 8 15 818. [9] Ammar, E. S., and ... Bonding and Deep Reactive Ion Etching; A New Technology for Microstructures,” Proc. 8th Int. Conf. on Solid-State Sensors and Actua - tors, Stockholm, Sweden, June 25 29, 19...

Ngày tải lên: 10/08/2014, 01:22

... affecting the validity of any trade - mark or service mark. International Standard Book Number: 1 -5 8 05 3 -5 9 0-9 10987 654 321 To our families Tanya, Ella, and Jad Erika, Gordon, Brynn, and Reed “It was the ... student alike to an understanding of how MEMS are designed and fabricated. Dr. Maluf s book concentrates mostly on how to design and manufacture MEMS....

Ngày tải lên: 10/08/2014, 01:22

... for optoelectronic and passive fiber-optical components (see Table 8.8) explicitly reference the MIL-STD-202 and 883 standards. Procedures and methods also accompany the MIL standards to guide ... Telecommunications Test GR-63/463-CORE Reliability Assurance for Optoelectronic Devices GR-1209/1221-CORE Reliability Assurance for Branched and Passive Fiber-Optic Devices Mechanical shoc...

Ngày tải lên: 10/08/2014, 01:22

... Vector algebra (using a dot product) shows that the angles between {100} and {110} planes are 45 or 90º, and the angles between {100} and {111} planes are 54 .7º or 1 25. 3º. Similarly, {111} and ... components for identify-friend-or-foe systems Head- and night-display systems Low-power, high-density mass data storage devices Embedded sensors and actuators for condition-based mai...

Ngày tải lên: 10/08/2014, 01:22

... Zorman, C. A., and M. Mehregany, “Materials for Microelectromechanical Systems,” in The MEMS Handbook, Chapter 15, M. Gad-el-Hak (ed.), Boca Raton, FL: CRC Press, 2002. [10] Zhang, Z. L., and ... meaning lithography, elec - troplating, and molding. both PSG and BPSG soften and flow to conform with the underlying surface topog - raphy and to improve step coverage. LTO...

Ngày tải lên: 10/08/2014, 01:22

... No Temperature 25 C 70º–90°C 1 15 C 90°C 0º–100°C 20º–80°C 20°C Etch rate (µm/min) 1 to 20 0 .5 to 3 0. 75 0 .5 to 1 .5 0.1 to 0 .5 1 to 15 0.1 to 10 {111}/{100} Selectivity None 100:1 35: 1 50 :1 None None ... Wet etchants in aqueous solution offer the advantage of low-cost batch fabrication— 25 to 50 100-mm-diameter wafers can be etched simultaneously and can be eith...

Ngày tải lên: 10/08/2014, 01:22

... orientation-dependent etching of grooves, wafer bonding, and dicing [8], and (b) nozzle formed by DRIE and wafer bonding. (After: [9].) Mandrel Photoresist 1. Make mandrel, pattern photoresist Metal 2. ... 9.81 m/s 2 ), sensitivity (V/G), reso - lution (G), bandwidth (Hz), cross-axis sensitivity, and immunity to shock. The range and bandwidth required vary significantly depend...

Ngày tải lên: 10/08/2014, 01:22

... )]°⋅sHz ; bandwidth (Hz); resolution (º/s); and dynamic range (dB), the lat- ter two being functions of noise and bandwidth. Short- and long-term drift of the output, known as bias drift, is another ... dioxide insulator TaAl resistor Al conductor 1. Grow oxide for insulator, sputter TaAl and Al, pattern Al and TaAl, pattern Al again to form resistor and conductive trace. 2. PEC...

Ngày tải lên: 10/08/2014, 01:22

... Netherlands, January 29–February 2, 19 95, pp. 19–24. Selected Bibliography Frank, R., Understanding Smart Sensors, Norwood, MA: Artech House, 1996. Gad-El-Hak, M., The MEMS Handbook, Boca Raton, ... D. Baker, and L. N. Goenka, “Silicon Micromachined CO 2 Cleaning Noz - zle and Method,” U.S. Patent 5, 5 45, 073, August 13, 1996. [10] Siewell, G. L., W. R. Boucher, and P. H. McCl...

Ngày tải lên: 10/08/2014, 01:22

... processing and routing of data and voice. The use of tunable lasers in telecommunications has been primarily in the wavelength range of 1 ,52 8 nm to 1 ,56 5 nm (known as the C-Band) and 1 ,57 0 nm to 1,610 ... unloaded actuator on the right-hand side is equal to the mass of the loaded actuator (left-hand side) and the mirror. Externally applied in-plane accelerations cause equa...

Ngày tải lên: 10/08/2014, 01:22