An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 5 doc
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 5 doc
... Benecke, and P. Lange, “TMAHW Etchants for Silicon
Micromachining,” Proc. 1991 Int. Conf. on Solid-State Sensors and Actuators, San Fran-
cisco, CA, June 24–27, 1991, pp. 8 15 818.
[9] Ammar, E. S., and ... Bonding and Deep Reactive Ion Etching; A New
Technology for Microstructures,” Proc. 8th Int. Conf. on Solid-State Sensors and Actua
-
tors, Stockholm, Sweden, June 25 29, 19...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 1 doc
... affecting the validity of any trade
-
mark or service mark.
International Standard Book Number: 1 -5 8 05 3 -5 9 0-9
10987 654 321
To our families
Tanya, Ella, and Jad
Erika, Gordon, Brynn, and Reed
“It was the ... student alike to an understanding of how MEMS are
designed and fabricated. Dr. Maluf s book concentrates mostly on how to design
and manufacture MEMS....
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 14 docx
... for optoelectronic and passive
fiber-optical components (see Table 8.8) explicitly reference the MIL-STD-202 and
883 standards. Procedures and methods also accompany the MIL standards to
guide ... Telecommunications
Test GR-63/463-CORE Reliability
Assurance for Optoelectronic Devices
GR-1209/1221-CORE Reliability Assurance
for Branched and Passive Fiber-Optic Devices
Mechanical
shoc...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 2 pptx
... Vector
algebra (using a dot product) shows that the angles between {100} and {110} planes
are 45 or 90º, and the angles between {100} and {111} planes are 54 .7º or 1 25. 3º.
Similarly, {111} and ... components for identify-friend-or-foe
systems
Head- and night-display systems
Low-power, high-density mass data storage devices
Embedded sensors and actuators for condition-based mai...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 3 pps
... Zorman, C. A., and M. Mehregany, “Materials for Microelectromechanical Systems,” in
The MEMS Handbook, Chapter 15, M. Gad-el-Hak (ed.), Boca Raton, FL: CRC Press,
2002.
[10] Zhang, Z. L., and ... meaning lithography, elec
-
troplating, and molding.
both PSG and BPSG soften and flow to conform with the underlying surface topog
-
raphy and to improve step coverage. LTO...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 4 pptx
... No
Temperature 25 C 70º–90°C 1 15 C 90°C 0º–100°C 20º–80°C 20°C
Etch rate
(µm/min)
1 to 20 0 .5 to 3 0. 75 0 .5 to 1 .5 0.1 to 0 .5 1 to 15 0.1 to 10
{111}/{100}
Selectivity
None 100:1 35: 1 50 :1 None None ... Wet etchants in aqueous solution offer the advantage of low-cost batch
fabrication— 25 to 50 100-mm-diameter wafers can be etched simultaneously and
can be eith...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 6 pptx
... orientation-dependent
etching of grooves, wafer bonding, and dicing [8], and (b) nozzle formed by DRIE and wafer
bonding. (After: [9].)
Mandrel
Photoresist
1. Make mandrel, pattern photoresist
Metal
2. ... 9.81 m/s
2
), sensitivity (V/G), reso
-
lution (G), bandwidth (Hz), cross-axis sensitivity, and immunity to shock. The
range and bandwidth required vary significantly depend...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 7 pot
... )]°⋅sHz
; bandwidth (Hz); resolution (º/s); and dynamic range (dB), the lat-
ter two being functions of noise and bandwidth. Short- and long-term drift of the
output, known as bias drift, is another ... dioxide
insulator
TaAl resistor
Al conductor
1. Grow oxide for insulator, sputter TaAl and Al, pattern Al and TaAl,
pattern Al again to form resistor and conductive trace.
2. PEC...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 8 ppt
... Netherlands, January 29–February 2, 19 95,
pp. 19–24.
Selected Bibliography
Frank, R., Understanding Smart Sensors, Norwood, MA: Artech House, 1996.
Gad-El-Hak, M., The MEMS Handbook, Boca Raton, ... D. Baker, and L. N. Goenka, “Silicon Micromachined CO
2
Cleaning Noz
-
zle and Method,” U.S. Patent 5, 5 45, 073, August 13, 1996.
[10] Siewell, G. L., W. R. Boucher, and P. H. McCl...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 9 pps
... processing and routing of data and voice. The use of tunable lasers in
telecommunications has been primarily in the wavelength range of 1 ,52 8 nm to
1 ,56 5 nm (known as the C-Band) and 1 ,57 0 nm to 1,610 ... unloaded actuator on the right-hand side is equal to the
mass of the loaded actuator (left-hand side) and the mirror. Externally applied
in-plane accelerations cause equa...