An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 2 pptx
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 2 pptx
... 1 .2 Analysis and Forecast of Worldwide MEMS Markets (in Millions of U.S. Dollars) 20 02 2007($ 000,000) ($ 000,000)Microfluidics 1,404 2, 241Optical MEMS 7 02 1, 826 RF MEMS 39 24 9Other actuators ... MarketStudy,” January 1999, 1 429 North Quincy Street, Arlington, VA 22 207.[3] Frost and Sullivan, “World Sensors Market: Strategic Analysis,” Report 550 9-3 2, February1999, 25 25 Charleston Road, ... GmbH of Teltow, Ger-many, and is available on-line.•Micro/Nano Newsletter: a publication companion to “R&D Magazine”with news and updates on micromachined devices and nanoscale-leveltechnologies....
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 4 pptx
... it is to achieve good bonding [21 ].Grinding, Polishing, and Chemical-Mechanical PolishingSome applications use a thin layer of silicon (5 to 20 0 µm) that is fusion-bonded to astandard-thickness ... Wet etchants in aqueous solution offer the advantage of low-cost batchfabrication 25 to 50 100-mm-diameter wafers can be etched simultaneously and can be either of the isotropic or anisotropic ... uniform and controlled etch depths. Some applications, such asbulk-micromachined pressure sensors, demand a thin ( 5- to 2 0- m) silicon mem - brane with dimensional thickness control and uniformity...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 6 pptx
... Structures and Systems in Industrial and Automotive ApplicationsBondpadMetal conductorsP-type diffusedpiezoresistorEtched cavityN-typeepitaxiallayerP-typesubstrate and frameAnodicallybondedPyrex ... 9.81 m/s 2 ), sensitivity (V/G), reso - lution (G), bandwidth (Hz), cross-axis sensitivity, and immunity to shock. Therange and bandwidth required vary significantly depending on the application.Accelerometers ... bottom handle wafer. Silicon-fusion bonding of a p-type top wafer with an n-type epixatial layer encapsulates and seals the cavity. Electrochemical etchingor standard polishing thins down the top...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 11 pptx
... there are 24 discreteinductors (in addition to even more capacitors and resistors) along with only 15integrated circuits [ 12] . To alleviate the self-resonance shortcoming and to reducethe part ... of expansion mismatch factor into substrateselection.Passive Electrical Components: Capacitors and InductorsQuality Factor and Parasitics in Passive ComponentsAll capacitors and inductors ... than 10 at 2 GHz [11].One approach to improving both quality factor and self-resonance frequency is to reduce the parasitic capacitance and substrate conductive loss by changing to an insulating...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 1 doc
... and Media Isolation 22 2Hermetic Packaging 22 3Calibration and Compensation 22 4Die-Attach Processes 22 5Wiring and Interconnects 22 7Electrical Interconnects 22 7Microfluidic Interconnects 23 1Optical ... Micro; and Stephen Durant and Christopher Eide ofMorrison and Foerster. Evan Green and Carter Hand of New Focus were kindenough to review portions of the manuscript. Thanks go to our editor, ... Films 20 Polymers 21 Other Materials and Substrates 21 Glass and Fused Quartz Substrates 21 Silicon Carbide and Diamond 22 Gallium Arsenide and Other Group III-V Compound Semiconductors 22 Polymers...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 3 pps
... Zorman, C. A., and M. Mehregany, “Materials for Microelectromechanical Systems,” inThe MEMS Handbook, Chapter 15, M. Gad-el-Hak (ed.), Boca Raton, FL: CRC Press, 20 02. [10] Zhang, Z. L., and ... meaning lithography, elec - troplating, and molding.both PSG and BPSG soften and flow to conform with the underlying surface topog - raphy and to improve step coverage. LTO films are used for passivation ... gold-cadmium alloy in 1951 but was quickly extended to a broad range of other alloys, including titanium-nickel, copper-aluminum-nickel,iron-nickel and iron-platinum alloys. A basic understanding...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 5 doc
... 36 12 36 32. [8] Schnakenberg, U., W. Benecke, and P. Lange, “TMAHW Etchants for SiliconMicromachining,” Proc. 1991 Int. Conf. on Solid-State Sensors and Actuators, San Fran-cisco, CA, June 24 27 , ... 156–161. [26 ] MicroChem Corp., Data Sheet for NANO SU-8 20 00, Newton, MA, February 20 02. [27 ] Mikroglas Teknik AG, “FOTURAN—A Photostructurable Glass,” Mainz, Germany, 20 03. [28 ] Ehrfeld, W., and U. ... height to width) of 20 :1 are regularly produced. The cured material is resis - tant to most chemicals and is thermally stable. SU-8 has been used to form microflu - idic channels and optical waveguides....
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 7 pot
... )]°⋅sHz; bandwidth (Hz); resolution (º/s); and dynamic range (dB), the lat-ter two being functions of noise and bandwidth. Short- and long-term drift of theoutput, known as bias drift, is another ... dioxideinsulatorTaAl resistorAl conductor1. Grow oxide for insulator, sputter TaAl and Al, pattern Al and TaAl,pattern Al again to form resistor and conductive trace. 2. PECVD silicon nitride and ... dynamic and full of motion. If sen - sors extend our faculties of sight, hearing, smell, and touch, then actuators must bethe extension to our hands and fingers. They give us the agility and dexterity...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 8 ppt
... Netherlands,January 29 –February 2, 1995, pp. 21 6 21 9.[46] U.S. Patent 6, 523 ,560 B1, February 25 , 20 03, and U.S. Patent application publicationUS20 02/ 0174891 A1, November 28 , 20 02. [47] Williams, ... Netherlands, January 29 –February 2, 1995,pp. 19 24 .Selected BibliographyFrank, R., Understanding Smart Sensors, Norwood, MA: Artech House, 1996.Gad-El-Hak, M., The MEMS Handbook, Boca Raton, ... Digest Solid-State Sen - sor and Actuator Workshop, Hilton Head Island, SC, June 3–6, 1996, pp. 20 0 20 4.[39] Allen, R. R., J. D. Meyer, and W. R. Knight, “Thermodynamics and Hydrodynamics ofThermal...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 9 pps
... unloaded actuator on the right-hand side is equal to themass of the loaded actuator (left-hand side) and the mirror. Externally appliedin-plane accelerations cause equal but opposite torques on ... processing and routing of data and voice. The use of tunable lasers intelecommunications has been primarily in the wavelength range of 1, 528 nm to 1,565 nm (known as the C-Band) and 1,570 nm to 1,610 ... (known as the L-Band).The International Telecommunication Union (ITU) of Geneva, Switzerland, hasspecified the use to be on a grid of discrete channels throughout the C- and L-Bandsat optical...
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