SMT Soldering Handbook surface mount technology 2nd phần 4 potx
SMT Soldering Handbook surface mount technology 2nd phần 4 potx
... board through
the soldering line. The maximum conveyor speeds which can be achieved with a
112 Wavesoldering
job:LAY 04 page :44 colour:1 black–text
4. 6 Board conveyor systems
4. 6.1 Functional requirements
Boards ... vendors of fluxes or soldering
accessories. They record the exit temperature through an irreversible and distinct
102 Wavesoldering
job:LAY 04 page :40 colour:1 black–te...
SMT Soldering Handbook surface mount technology 2nd phần 5 potx
... adhesives.
Overhead soldering
Reflowsoldering boards with SMDs on both sides involves ‘overhead soldering , for
which two different strategies are possible:
Reflowsoldering 149
job:LAY05 page: 14 colour:1 ... to or identical with a
reflowsoldering oven (Section 5 .4. 4). It must be remembered, however, that with
Wavesoldering 145
job:LAY05 page:2 colour:1 black–text
5 Reflowsoldering
5.1 The...
SMT Soldering Handbook surface mount technology 2nd phần 1 doc
... colour:1 black–text
4 Wavesoldering 84
4.1 The wave concept 84
4.1.1 Wavesoldering before SMDs 84
4.1.2 Wavesoldering after SMDs 85
4. 2 Applying the flux 87
4. 2.1 Types of fluxer 87
4. 2.2 Monitoring ... unit 103
4. 4.2 Thermal role of the solderwave 1 04
4 .4. 3 Interaction between molten solder and the
circuit board 105
4. 4 .4 Chipwaves 110
4. 4.5 Formation and control of dros...
SMT Soldering Handbook surface mount technology 2nd phần 2 docx
... thickness
Soldering method Confrontation Temperature Zone
period °C °F thickness
m
Wavesoldering 2–5 sec 250 48 0 0.3–0.8
Reflow:
Laser 0.02–0. 04 sec 250–350 48 0–900 O0.1
Vapour phase 25 40 sec 215 41 9 ... 100% Pb 60 Sn /40 Pb 60 Sn /40
Pb+Ag 100% Sn
Bulk strength*
tons/sq. in 0.9 4. 0 4. 5 1.1
N/sq. mm 140 620 700 170
Shear joint strength on copper*
tons/sq. in — 2.8 — —
N/sq...
SMT Soldering Handbook surface mount technology 2nd phần 3 doc
... 3. 14) .
Wavesoldering, vapourphase soldering, hot air or gas convection soldering,
impulse soldering and handsoldering with a soldering iron present equilibrium
Soldering 61
job:LAY03 page :41 ... 11.2.2.
66 Soldering
job:LAY03 page :44 colour:1 black–text
Figure 3. 14
Equilibrium and non-equilibrium heating situations
heating conditions. Infrared soldering, laser soldering an...
SMT Soldering Handbook surface mount technology 2nd phần 6 doc
... energy:
watt/cm 0 .43 0.60 0.89 2.0 5.1
watt/in 2.58 3.60 5. 34 12.0 30.6
kw/m 4. 3 6.0 8.9 20 51
Wavelength of 5.5 m 5.0 m 4. 6 m 3.7 m 2 .4 m
the energy
maximum:
max
Emitted energy 0.6 1.0 1.5 4. 4 13.9
at ... distance (‘snap-off’) from
Reflowsoldering 175
job:LAY05 page :40 colour:1 black–text
Figure 5.10
In-line vapourphase soldering system
5 .4. 5 ‘New-generation’ vapourph...
SMT Soldering Handbook surface mount technology 2nd phần 7 pot
... Marczi, M. (1990) Development of a
fluxless soldering process for surface mount technology. Soldering and Surface
Mount Technology, No. 4, pp. 23–26. See also USP 4. 960.236.
33. Nylen, M. and Norgren, ... Printing Solderpaste. Surface Mount
Intern., Vol. 4, Issues 4 and 5.
8. Chilton, A. C. and Gaugler, K. W. (1990) Fine Pitch Solder Creams. Soldering
& Surface...
SMT Soldering Handbook surface mount technology 2nd phần 8 pptx
... °F27
CHC 111** 74. 1 °C/165 .4 °F 1 24
CFC 113/Methanol azeotrope 39.6 °C/103.3 °F45
CFC 113/Isopropanol azeotrope 46 .4 °C/115.5 °F47
CFC 113/Methanol/Dichloroethylene azeotrope* 38 .4 °C/101.1 °F ... (methanol) 0.791 65.1 °C12°C 200 polar
149 .2 °F 54 F
Ethyl alcohol (ethanol) 0.789 78.5 °C 14 C 1000 polar
173.3 °F57°F
Isopropyl alcohol (isopropanol) 0.786 82 .4 °C13°C 40 0 polar
18...
SMT Soldering Handbook surface mount technology 2nd phần 9 pdf
... (1990) Surface Mount Components and the Ozone Layer De-
pletion Problem. Proc. SMTCON, Atlantic City, NJ, pp. 103–106.
12. Lea, C. (1988) loc. cit., p. 44 9.
13. Lea, C. (1988) loc. cit., p. 44 7.
14. ... 1.0)
(years)
CFC 113 47 .6 °C/117.7 °F 27 90 0.85 1.3
CHC 111 74. 1 °C/165 .4 °F 1 24 6.3 0.13 0.02
HCFC 123 28.0 °C/82 .4 °F 68 1.6 0.02 0.02
HCFC 141 b 32.0°C/89.6 °F 61 12 0.15...
SMT Soldering Handbook surface mount technology 2nd phần 10 pdf
... microstructure, 39, 40
failure, 44 , 45
long-term behaviour, 40 , 43
mechanical properties, 40 , 42
microstructure, 39, 40
reliability, 44 , 45
solidification range, 39
solidification time-interval, 39
Soldering ... management, 236–238
Circuitboard layout:
for BGAs, 249
for mixed component boards, 247
for reflow soldering, 247 – 249
for wavesoldering, 244 – 246
Clean-up af...