SMT Soldering Handbook surface mount technology 2nd phần 4 potx
SMT Soldering Handbook surface mount technology 2nd phần 4 potx
... board through the soldering line. The maximum conveyor speeds which can be achieved with a 112 Wavesoldering job:LAY 04 page :44 colour:1 black–text 4. 6 Board conveyor systems 4. 6.1 Functional requirements Boards ... vendors of fluxes or soldering accessories. They record the exit temperature through an irreversible and distinct 102 Wavesoldering job:LAY 04 page :40 colour:1 black–te...
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SMT Soldering Handbook surface mount technology 2nd phần 5 potx
... adhesives. Overhead soldering Reflowsoldering boards with SMDs on both sides involves ‘overhead soldering , for which two different strategies are possible: Reflowsoldering 149 job:LAY05 page: 14 colour:1 ... to or identical with a reflowsoldering oven (Section 5 .4. 4). It must be remembered, however, that with Wavesoldering 145 job:LAY05 page:2 colour:1 black–text 5 Reflowsoldering 5.1 The...
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SMT Soldering Handbook surface mount technology 2nd phần 1 doc
... colour:1 black–text 4 Wavesoldering 84 4.1 The wave concept 84 4.1.1 Wavesoldering before SMDs 84 4.1.2 Wavesoldering after SMDs 85 4. 2 Applying the flux 87 4. 2.1 Types of fluxer 87 4. 2.2 Monitoring ... unit 103 4. 4.2 Thermal role of the solderwave 1 04 4 .4. 3 Interaction between molten solder and the circuit board 105 4. 4 .4 Chipwaves 110 4. 4.5 Formation and control of dros...
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SMT Soldering Handbook surface mount technology 2nd phần 2 docx
... thickness Soldering method Confrontation Temperature Zone period °C °F thickness m Wavesoldering 2–5 sec 250 48 0 0.3–0.8 Reflow: Laser 0.02–0. 04 sec 250–350 48 0–900 O0.1 Vapour phase 25 40 sec 215 41 9 ... 100% Pb 60 Sn /40 Pb 60 Sn /40 Pb+Ag 100% Sn Bulk strength* tons/sq. in 0.9 4. 0 4. 5 1.1 N/sq. mm 140 620 700 170 Shear joint strength on copper* tons/sq. in — 2.8 — — N/sq...
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SMT Soldering Handbook surface mount technology 2nd phần 3 doc
... 3. 14) . Wavesoldering, vapourphase soldering, hot air or gas convection soldering, impulse soldering and handsoldering with a soldering iron present equilibrium Soldering 61 job:LAY03 page :41 ... 11.2.2. 66 Soldering job:LAY03 page :44 colour:1 black–text Figure 3. 14 Equilibrium and non-equilibrium heating situations heating conditions. Infrared soldering, laser soldering an...
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SMT Soldering Handbook surface mount technology 2nd phần 6 doc
... energy: watt/cm 0 .43 0.60 0.89 2.0 5.1 watt/in 2.58 3.60 5. 34 12.0 30.6 kw/m 4. 3 6.0 8.9 20 51 Wavelength of 5.5 m 5.0 m 4. 6 m 3.7 m 2 .4 m the energy maximum: max Emitted energy 0.6 1.0 1.5 4. 4 13.9 at ... distance (‘snap-off’) from Reflowsoldering 175 job:LAY05 page :40 colour:1 black–text Figure 5.10 In-line vapourphase soldering system 5 .4. 5 ‘New-generation’ vapourph...
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SMT Soldering Handbook surface mount technology 2nd phần 7 pot
... Marczi, M. (1990) Development of a fluxless soldering process for surface mount technology. Soldering and Surface Mount Technology, No. 4, pp. 23–26. See also USP 4. 960.236. 33. Nylen, M. and Norgren, ... Printing Solderpaste. Surface Mount Intern., Vol. 4, Issues 4 and 5. 8. Chilton, A. C. and Gaugler, K. W. (1990) Fine Pitch Solder Creams. Soldering & Surface...
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SMT Soldering Handbook surface mount technology 2nd phần 8 pptx
... °F27 CHC 111** 74. 1 °C/165 .4 °F 1 24 CFC 113/Methanol azeotrope 39.6 °C/103.3 °F45 CFC 113/Isopropanol azeotrope 46 .4 °C/115.5 °F47 CFC 113/Methanol/Dichloroethylene azeotrope* 38 .4 °C/101.1 °F ... (methanol) 0.791 65.1 °C12°C 200 polar 149 .2 °F 54 F Ethyl alcohol (ethanol) 0.789 78.5 °C 14 C 1000 polar 173.3 °F57°F Isopropyl alcohol (isopropanol) 0.786 82 .4 °C13°C 40 0 polar 18...
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SMT Soldering Handbook surface mount technology 2nd phần 9 pdf
... (1990) Surface Mount Components and the Ozone Layer De- pletion Problem. Proc. SMTCON, Atlantic City, NJ, pp. 103–106. 12. Lea, C. (1988) loc. cit., p. 44 9. 13. Lea, C. (1988) loc. cit., p. 44 7. 14. ... 1.0) (years) CFC 113 47 .6 °C/117.7 °F 27 90 0.85 1.3 CHC 111 74. 1 °C/165 .4 °F 1 24 6.3 0.13 0.02 HCFC 123 28.0 °C/82 .4 °F 68 1.6 0.02 0.02 HCFC 141 b 32.0°C/89.6 °F 61 12 0.15...
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SMT Soldering Handbook surface mount technology 2nd phần 10 pdf
... microstructure, 39, 40 failure, 44 , 45 long-term behaviour, 40 , 43 mechanical properties, 40 , 42 microstructure, 39, 40 reliability, 44 , 45 solidification range, 39 solidification time-interval, 39 Soldering ... management, 236–238 Circuitboard layout: for BGAs, 249 for mixed component boards, 247 for reflow soldering, 247 – 249 for wavesoldering, 244 – 246 Clean-up af...
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